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AMD-K6-2E/233AMZ Datasheet(PDF) 310 Page - Advanced Micro Devices |
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AMD-K6-2E/233AMZ Datasheet(HTML) 310 Page - Advanced Micro Devices |
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310 / 332 page ![]() 292 Thermal Design Chapter 16 AMD-K6™-2E Processor Data Sheet 22529B/0—January 2000 Preliminary Information Socketed Installation: Maximum Ambient Temperature Table 70 and Figure 106 show the measured maximum ambient temperature (TA) values in °C at different levels of airflow in the system for the low-power embedded AMD-K6-2E processors with a maximum thermal power dissipation of 10.0 watts (for OP Ns: AMD-K6-2E/26 6A MZ , AM D- K6 -2E/300 AMZ, and AMD-K6-2E/333AMZ) and a maximum case temperature rating of 85 °C, in the 321-pin Ceramic Pin Grid Array package (CPGA) when installed into a socket. Figure 106. Measured Maximum Ambient Temperature (Socketed 321-Pin CPGA Package) Table 70. Socketed CPGA Package: Measured Maximum Ambient Temperature (°C) Heatsink Type Maximum TA (°C) v. Airflow (m/s) 0.0 m/s 1.0 m/s 2.0 m/s 3.0 m/s 4.0 m/s No Heatsink -10 °C 6 °C 21 °C 36 °C 43 °C A (15 mm) 20 °C 42 °C 54 °C 59 °C 62 °C B (20 mm) 28 °C 47 °C 58 °C 62 °C 65 °C C (30mm) 38 °C 57 °C 67 °C 70 °C 72 °C TC = 85°C, Pd = 10 W -20 -10 0 10 20 30 40 50 60 70 80 01234 Airflow Rate (m/s) 1RQH $ % & |
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