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SST26VF016B-104V/SN Datasheet(PDF) 41 Page - Microchip Technology

Part # SST26VF016B-104V/SN
Description  2.5V/3.0V 16-Mbit Serial Quad I/O™ (SQI™) Flash Memory
PDF  84 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

SST26VF016B-104V/SN Datasheet(HTML) 41 Page - Microchip Technology

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2014-2022 Microchip Technology Inc. and its subsidiaries
DS20005262G-page 41
SST26VF016B
5.38 Deep Power-Down
The Deep Power-Down (DPD) instruction puts the
device in the lowest power consumption mode – the
Deep Power-Down mode. The Deep Power-Down
instruction is ignored during an internal write operation.
While the device is in Deep Power-Down mode, all
instructions will be ignored except for the Release
Deep Power-Down instruction.
Enter Deep Power-Down mode by initiating the Deep
Power-Down (DPD) instruction (B9H) while driving CE#
low. CE# must be driven high before executing the DPD
instruction. After CE# is driven high, it requires a delay
of TDPD before the standby current ISB is reduced to
deep power-down current IDPD. See Table 5-7 for Deep
Power-Down timing. If the device is busy performing an
internal erase or program operation, initiating a Deep
Power-Down instruction will not place the device in
Deep Power-Down mode. See Figures 5-47 and for
the DPD instruction sequence.
FIGURE 5-46:
DEEP POWER-DOWN (
DPD) SEQUENCE (SQI)
FIGURE 5-47:
DEEP POWER-DOWN (
DPD) SEQUENCE (SPI)
TABLE 5-7:
DEEP POWER-DOWN
Symbol
Parameter
Min.
Max.
Units
TDPD
CE# High to Deep Power-Down
—
3
µs
TSBR
CE# High to Standby Mode
—
10
µs
Note:
MSN= Most Significant Nibble; LSN = Least Significant Nibble
MODE 3
SCK
SIO[3:0]
CE#
MODE 0
B9
MSN
LSN
0
1
TDPD
Standby Mode Deep Power-Down Mode
CE#
SO
SI
SCK
01 2 3 4 5 6 7
B9
High-Impedance
MODE 0
MODE 3
MSb
TDPD
Standby Mode Deep Power-Down Mode



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