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M65KG256AB Datasheet(PDF) 28 Page - STMicroelectronics

Part # M65KG256AB
Description  256Mbit (4 Banks x 4M x 16) 1.8V Supply, 133MHz Clock Rate, DDR Low Power SDRAM
PDF  51 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

M65KG256AB Datasheet(HTML) 28 Page - STMicroelectronics

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7 DC and AC parameters
M65KG256AB
28/51
Table 13.
DC Characteristics 2
Table 14.
Self Refresh Current (IDD6) in Normal Operating Mode
Symbol
Parameter
Test Condition(1)(2)
1.
VDD and VDDQ = 1.7 to 1.9V, VSS = VSSQ = 0V.
2.
IDD1 and IDD4 depend on output loading and cycle rates. Specified values are measured with the output open.
M65KG256AB Unit
IDD1
(2)
Operating Current
Burst length = 4, one bank active
tRC ≥ tRC(min), IOL = 0mA
60
mA
IDD2P
Precharge Standby Current in Power-
Down Mode
KE
≤VIL(max), tCK = 15ns
0.8
mA
IDD2PS
KE
≤VIL(max), tCK = ∞
0.6
IDD2N
Precharge Standby Current in Non
Power-Down Mode
KE
≥ VIH (min), E ≥ VIH (min),
tCK = 15ns, Input signals changed
once in 2 clock cycles.
3
mA
IDD2NS
KE
≥ VIH (min), tCK = ∞
Input signals are stable
2
IDD3P
Active Standby Current in Power-Down
Mode
KE
≤VIL(max), tCK = 15ns
1.5
mA
IDD3PS
KE
≤VIL(max), tCK = ∞
1.2
IDD3N
Active Standby Current in Non Power-
Down Mode
KE
≥ VIH (min), E ≥ VIH (min),
tCK = 15ns, Input signals are changed
once in 2 clock cycles.
10
mA
IDD3NS
KE
≥ VIH (min), tCK = ∞
Input signals are stable
7
IDD4
(2)
Burst Mode Current
tCK ≥ tCK (min), IOL = 0mA
All banks active
Burst Length = 4
130
mA
IDD5
(3)
3.
Addresses change only once during tCK.
Auto Refresh Current
tRRC ≥ tRRC (min)
60
mA
IDD6
Self Refresh Current
KE
≤0.2V
See Table 14
µA
IDD7
Standby Current in Deep Power-down
Mode
KE
≤0.2V (see Deep Power-Down
mode description)
10
µA
Temperature in °C
Memory Array(1)
1.
TJ = –30 to 85°C, VDD and VDDQ = 1.7 to 1.9V, VSS = VSSQ = 0V; KE ≤0.2V.
Unit
All Banks
2 Banks
1 Bank
Typ
Max
Typ
Max
Typ
Max
-30
≤TJ ≤40
200
160
160
µA
40
≤TJ ≤65
350
270
220
µA
65
≤TJ ≤85
550
400
320
µA



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