PIC16F18344-ISLASHSS datasheet(20/489 Pages) MICROCHIP

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PIC16(L)F18324/18344

DS40001800C-page 20

 2015-2017 Microchip Technology Inc.

2.0

GUIDELINES FOR GETTING

STARTED WITH

PIC16(L)F183XX

MICROCONTROLLERS

2.1

Basic Connection Requirements

Getting started with the PIC16(L)F183XX family of 8-bit

microcontrollers requires attention to a minimal set of

device pin connections before proceeding with

development.

The following pins must always be connected:

•All VDD and VSS pins

(see Section 2.2 “Power Supply Pins”)

•MCLR

(when

configured

for

external

operation)

(see Section 2.3 “Master Clear (MCLR) Pin”)

These pins must also be connected if they are being

used in the end application:

• ICSPCLK/ICSPDAT pins used for In-Circuit Serial

Programming™

(ICSP™)

and

debugging

purposes (see Section 2.4 “ICSP™ Pins”)

• OSC1 and OSC2 pins when an external oscillator

source is used

(see Section 2.5 “External Oscillator Pins”)

Additionally, the following pins may be required:

•VREF+/VREF- pins are used when external voltage

reference for analog modules is implemented

The minimum mandatory connections are shown in

Figure 2-1.

FIGURE 2-1:

RECOMMENDED

MINIMUM CONNECTIONS

2.2

Power Supply Pins

2.2.1

DECOUPLING CAPACITORS

The use of decoupling capacitors on every pair of

power supply pins (VDD and VSS) is required. All VDD

and VSS pins must be connected. None can be left

floating.

Consider the following criteria when using decoupling

capacitors:

• Value and type of capacitor: A 0.1 µF (100 nF),

10-20V capacitor is recommended. The capacitor

should be a low-ESR device, with a resonance

frequency in the range of 200 MHz and higher.

Ceramic capacitors are recommended.

• Placement on the printed circuit board: The

decoupling capacitors should be placed as close

to the pins as possible. It is recommended to

place the capacitors on the same side of the

board as the device. If space is constricted, the

capacitor can be placed on another layer on the

PCB using a via; however, ensure that the trace

length from the pin to the capacitor is no greater

than 0.25 inch (6 mm).

• Handling high-frequency noise: If the board is

experiencing high-frequency noise (upward of

tens of MHz), add a second ceramic type

capacitor in parallel to the above described

decoupling capacitor. The value of the second

capacitor can be in the range of 0.01 µF to

0.001 µF. Place this second capacitor next to

each primary decoupling capacitor. In high-speed

circuit designs, consider implementing a decade

pair of capacitances as close to the power and

ground pins as possible (e.g., 0.1 µF in parallel

with 0.001 µF).

• Maximizing performance: On the board layout

from the power supply circuit, run the power and

return traces to the decoupling capacitors first,

and then to the device pins. This ensures that the

decoupling capacitors are first in the power chain.

Equally important is to keep the trace length

between the capacitor and the power pins to a

minimum,

thereby

reducing

PCB

trace

inductance.

2.2.2

TANK CAPACITORS

On boards with power traces running longer than six

inches in length, it is suggested to use a tank capacitor

for integrated circuits, including microcontrollers, to

supply a local power source. The value of the tank

capacitor should be determined based on the trace

resistance that connects the power supply source to

the device, and the maximum current drawn by the

device in the application. In other words, select the tank

capacitor so that it meets the acceptable voltage sag at

the device. Typical values range from 4.7 µF to 47 µF.

VSS

VDD

MCLR/VPP

Key (all values are recommendations):

C1 and C2: 0.1 F, 20V ceramic

R1: 10 k

R2: 100

to 470

Note1: Only when MCLRE configuration bit is 1 and the

MCLR pin does not have a weak pull-up.

PIC16(L)F1xxx

(Note 1)

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