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PCIMX536AVV8B Datasheet(PDF) 155 Page - Freescale Semiconductor, Inc |
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PCIMX536AVV8B Datasheet(HTML) 155 Page - Freescale Semiconductor, Inc |
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155 / 180 page ![]() Package Information and Contact Assignments i.MX53xA Automotive and Infotainment Applications Processors, Rev. 1 Freescale Semiconductor 155 6 Package Information and Contact Assignments This section includes the contact assignment information and mechanical package drawing. 6.1 19x19 mm Package Information This section contains the outline drawing, signal assignment map, ground/power reference ID (by ball grid location) for the 19 × 19 mm, 0.8 mm pitch package. 6.1.1 Case TEPBGA-2, 19 x 19 mm, 0.8 mm Pitch, 23 x 23 Ball Matrix Figure 102 shows the top view of the 19 ×19 mm package, Figure 103 shows the bottom view and the ball location (529 solder balls) of the 19 ×19 mm package, and Figure 104 shows the side view of the 19×19 mm package. Figure 102. 19 x 19 mm Package Top View |
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