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SL3S1205FUD2/HAP Datasheet(PDF) 26 Page - NXP Semiconductors |
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SL3S1205FUD2/HAP Datasheet(HTML) 26 Page - NXP Semiconductors |
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26 / 38 page ![]() NXP Semiconductors SL3S1205_15 UCODE 8/8m 9.6.10 Large Pads 9.6.10.1 Description The large gold pads introduced in UCODE 8/8m enable more robust and reliable assembly. The new pad design allows not only more freedom in the placement accuracy (see "Rotation tolerant pad design" ). It also brings advantages in high-speed assembly due to the dual axis glue spacer (see "Dual axis glue spacer" ). aaa-027141 RF1 RF2 TP2 TP1 RF1 RF2 TP2 TP1 RF1 RF2 TP2 TP1 Figure 10. Rotation tolerant pad design aaa-027140 RF1 RF2 TP2 TP1 Figure 11. Dual axis glue spacer SL3S1205_15 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2021. All rights reserved. Product data sheet Rev. 3.5 — 1 April 2021 COMPANY PUBLIC 398435 26 / 38 |
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