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SL3S1205FUD2/HAP Datasheet(PDF) 5 Page - NXP Semiconductors

Part # SL3S1205FUD2/HAP
Description  UCODE 8/8m
PDF  38 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

SL3S1205FUD2/HAP Datasheet(HTML) 5 Page - NXP Semiconductors

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NXP Semiconductors
SL3S1205_15
UCODE 8/8m
4 Ordering information
Type number
Package
Name
IC type
Description
Version
SL3S1205FUD/HA
Wafer
UCODE 8
Die on sawn 8" 120 μm wafer 10 μm Polyimide spacer
with Large Pads, Stealth Dicing
not applicable
SL3S1215FUD/HA
Wafer
UCODE 8m Die on sawn 8" 120 μm wafer 10 μm Polyimide spacer
with Large Pads, Stealth Dicing
not applicable
SL3S1205FUD2/HA
Wafer
UCODE 8
Die on sawn 12" 120 μm wafer 10 μm Polyimide
spacer
with Large Pads, Conventional Dicing
not applicable
SL3S1215FUD2/HA
Wafer
UCODE 8m Die on sawn 12" 120 μm wafer 10 μm Polyimide
spacer
with Large Pads, Conventional Dicing
not applicable
SL3S1205FUD2/HAP
Wafer
UCODE 8
Die on sawn 12" 120 μm wafer 10 μm Polyimide
spacer
with Large Pads, Plasma Dicing
not applicable
SL3S1215FUD2/HAP
Wafer
UCODE 8m Die on sawn 12" 120 μm wafer 10 μm Polyimide
spacer
with Large Pads, Plasma Dicing
not applicable
Table 1. Ordering information
SL3S1205_15
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2021. All rights reserved.
Product data sheet
Rev. 3.5 — 1 April 2021
COMPANY PUBLIC
398435
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