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SL3S1205FUD2/HAP Datasheet(PDF) 33 Page - NXP Semiconductors |
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SL3S1205FUD2/HAP Datasheet(HTML) 33 Page - NXP Semiconductors |
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33 / 38 page ![]() NXP Semiconductors SL3S1205_15 UCODE 8/8m 15 Revision history Document ID Release date Data sheet status Change notice Supersedes SL3S1205_15 v. 3.5 20210401 Product data sheet - SL3S1205_15 v. 3.4 Modifications: • Table 1 "Ordering information": Ordering information with UCODE 8, 12 inch plasma dicing updated • Section 7 "Wafer layout": Titles in wafer layout with stealth dicing and conventional dicing updated • Figure 5 " UCODE 8/8m, 12" wafer layout, Large Pads, plasma dicing": inserted • Table 5 "12 inch specification with Large Pads, plasma dicing ": inserted • Delivery form of UCODE 8/8m, 12 inch FC Bumps (SL3S1205FUD2/KP and SL3S1215FUD2/KP) discontinued • Related information removed SL3S1205_15 v. 3.4 20200131 Product data sheet - SL3S1205_15 v. 3.3 Modifications: • Introduction of 12 inch FC Bumps SL3S1205_15 v. 3.3 20191028 Product data sheet - SL3S1205_15 v. 3.2 Modifications: • Section 8.1.2 "12 inch Wafer with Large Pads": number of PGDW changed into 258934 SL3S1205_15 v. 3.2 20181119 Product data sheet - SL3S1205_15 v. 3.1 Modifications: • Introduction of 12 inch wafer delivery • Figure 3 "UCODE 8/8m, 8" wafer layout, Large Pads, stealth dicing" updated • Editorial changes in Table 8 "UCODE 8 overall memory map" • Editorial changes in Table 9 "UCODE 8m overall memory map" • Section 9.6.4 "Brand Identifier" updated SL3S1205_15 v. 3.1 20170630 Product data sheet - SL3S1205_15 v. 3.0 Modifications: • Wording: "Auto Adjust" replaced with "Self Adjust" SL3S1205_15 v. 3.0 20170703 Product data sheet - 398420 398420 20170531 Preliminary data sheet - 398410 398410 20160919 Objective data sheet - - Table 18. Revision history SL3S1205_15 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2021. All rights reserved. Product data sheet Rev. 3.5 — 1 April 2021 COMPANY PUBLIC 398435 33 / 38 |
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