SL3S1205FUD2SLASHHAP datasheet(38/38 Pages) NXP

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NXP Semiconductors

SL3S1205_15

UCODE 8/8m

Contents

General description ............................................ 1

Features and benefits .........................................2

2.1

Key features ...................................................... 2

2.1.1

Memory ..............................................................2

2.2

Supported features ............................................ 3

Applications .........................................................4

3.1

Target market .....................................................4

3.2

Applications ........................................................4

Ordering information .......................................... 5

Block diagram ..................................................... 6

Pinning information ............................................ 7

6.1

Pin description ................................................... 7

Wafer layout .........................................................8

Mechanical specification ..................................11

8.1

Wafer specification .......................................... 11

8.1.1

8 inch Wafer with Large Pads, stealth dicing ... 11

8.1.2

12 inch Wafer with Large Pads ........................12

8.1.3

Fail die identification ........................................14

8.1.4

Map file distribution ......................................... 14

Functional description ......................................15

9.1

Air interface standards .....................................15

9.2

Power transfer ................................................. 15

9.3

Data transfer ....................................................15

9.3.1

Interrogator to tag Link .................................... 15

9.3.2

Tag to interrogator Link ....................................15

9.4

Supported commands ......................................16

9.5

UCODE 8/8m memory .....................................16

9.5.1

UCODE 8/8m overall memory map ................. 17

9.5.2

UCODE 8/8m TID memory details ...................19

9.6

Supported features .......................................... 20

9.6.1

UCODE 8/8m features control mechanism ......20

9.6.2

Memory Safeguard .......................................... 22

9.6.2.1

Description .......................................................22

9.6.3

Self Adjust ....................................................... 23

9.6.3.1

Description .......................................................23

9.6.4

Brand Identifier ................................................ 23

9.6.4.1

Description .......................................................23

9.6.5

EPC+TID ..........................................................24

9.6.5.1

Description .......................................................24

9.6.6

Product Status Flag (PSF) ...............................24

9.6.6.1

Description .......................................................24

9.6.7

Backscatter strength reduction ........................ 24

9.6.8

Pre-serialization of the 96-bit EPC ...................24

9.6.8.1

Description .......................................................24

9.6.9

Single-slit antenna solution ..............................25

9.6.9.1

Description .......................................................25

9.6.10

Large Pads ...................................................... 26

9.6.10.1 Description .......................................................26

9.6.11

Custom commands ..........................................27

Limiting values ..................................................28

Characteristics .................................................. 29

11.1

UCODE 8/8m bare die characteristics .............29

Packing information ..........................................30

12.1

Wafer ............................................................... 30

Abbreviations .................................................... 31

References .........................................................32

Revision history ................................................ 33

Legal information ..............................................34

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section 'Legal information'.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 1 April 2021

Document number: 398435

SL3S1205FUD2/HAP Datasheet(PDF) 38 Page - NXP Semiconductors

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