ZSSC3036

Low-Power 16-Bit Sensor Signal Conditioner IC

Data Sheet

May 28, 2013

© 2013 Zentrum Mikroelektronik Dresden AG

— Rev. 1.20

All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without

the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.

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Die Dimensions and Pad Assignments

The ZSSC3036 is available in die form with chip size (including scribe line) of 1.5mm

additional dimensions.

In Figure 4.1, the outer dimensions shown are estimations for a die after sawing with remaining scribe-line silicon

of approximately 20µm around the core die. Thus, the effective outer dimensions might differ slightly.

Figure 4.1

ZSSC3036 Pad Placement