ZSSC3036

Low-Power 16-Bit Sensor Signal Conditioner IC

Data Sheet

May 28, 2013

© 2013 Zentrum Mikroelektronik Dresden AG

— Rev. 1.20

All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without

the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.

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Table 4.1

Die Size & Geometry

Parameter

MIN [µm]

TYP [µm]

Description / Remarks

X-dimension

900

925

Includes

seal ring and remaining “empty” silicon after saw-

ing; maximum dimensions may be larger for engineering

samples due to wider scribe lines

Y-dimension

1560

1585

BondPad Size

(X & Y)

79.5

80

Passivation window opening

—effective area for bond

connection

60

60

Valid only for two special pads: VDD2 and EOC2 being

shorted with VDD and EOC, respectively

Minimum pitch for

application relevant

pads

200

-

Center-to-center distance; there are additional pads, which

are only for ZMDI’s test purposes

Die size adder

beyond seal ring

0

40

Potentially remaining silicon after die sawing

Sawing lane

80

-

Die to die distance

Table 4.2

Pin Assignments

Name

Direction

Type

Description

VDD1

IN

Supply

IC positive supply voltage for the IC, regular bond pad

VDD2

IC positive supply voltage for the IC, special pad (electrically

connected to VDD1, also bondable)

VSS

IN

Supply

Ground reference voltage signal

VSSB

OUT

Analog

Negative bridge supply (bridge sensor ground)

VDDB

OUT

Analog

Positive bridge supply

INP

IN

Analog

Positive bridge signal

INN

IN

Analog

Negative bridge signal

EOC1

OUT

Digital

End of conversion, regular bond pad

EOC2

End of conversion, special pad (electrically connected to EOC1,

also bondable)

SEL

IN

Digital

I²C

™ or SPI interface select

SCLK/SCL

IN

Digital

Clock input for I²C

™/SPI

MOSI/SDA

IN/Out

Digital

Data input for SPI; data in/out for I²C

™

MISO

OUT

Digital

Data output for SPI

SS

IN

Digital

Slave select for SPI

ZMDI-test

-

-

do not connect to these pads

5

Quality and Reliability

The ZSSC3036 is available in standard and extended qualification IC versions. For the standard version

ZSSC3036CCxxx, all data specified parameters are guaranteed if not stated otherwise.

For the extended qualification version ZSSC3036CIxxx, there is also specific testing in order to sort for IC-specific

(HTOL-qualified) early failures.