AMD-K6-2ESLASH233AMZ datasheet(281/332 Pages) AMD

281 / 332 page

Chapter 14

Electrical Data

263

22529B/0—January 2000

AMD-K6™-2E Processor Data Sheet

Preliminary Information

Figure 88. Suggested Component Placement

Decoupling

Recommendations

In addition to the isolation region mentioned in “Power

Connections” on page 262, adequate decoupling capacitance is

required between the two system power planes and the ground

plane to minimize ringing and to provide a low-impedance path

for return currents. Suggested decoupling capacitor placement

is shown in Figure 88.

Surface mounted capacitors should be used as close as possible

to the processor to minimize resistance and inductance in the

lead lengths while maintaining minimal height.

For recommendations about the specific value, quantity, and

location of the capacitors illustrated in Figure 88, see the AMD-

K6® Processor Power Supply Design Application Note, order

#21103.

0.254mm (min.) for

isolation region

CC2 (Core) Plane

CC3 (I/O) Plane

CC5

CC3

C11

C12

C13

C17

C18

C19

C20

C21

C22

C23

C24

C25

C26

C27

C28

C29

C30

C31

CC4

CC6

CC1

CC2

AMD-K6-2E/233AMZ Datasheet(PDF) 281 Page - Advanced Micro Devices

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