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XM33C321ASPZR Datasheet(PDF) 42 Page - Texas Instruments |
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XM33C321ASPZR Datasheet(HTML) 42 Page - Texas Instruments |
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42 / 122 page  7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT VDD Supply voltage At VDD pin –0.3 4.1 V VBAT Battery Backup Supply At VBAT pin, with respect to VSS –0.3 4.1 V VI Input voltage Applied to any common tolerance pins –0.3 VDD + 0.3 (4.1 MAX) V IVDD Maximum current into each VDD pin 160 mA IVSS Maximum current out of each VSS pin 160 mA IIO Current of SDIO pin Current sunk or sourced by SDIO pin, VDD>=2.7v 6 mA Current of HSIO pin Current sunk or sourced by HSIO pin, VDD>=2.7v 6 mA Current of HDIO pin Current sunk or sourced by HDIO pin, VDD>=2.7v 20 mA ID Supported diode current Diode current at any device pin -2 2 mA TA Ambient temperature Ambient temperature -40 125 °C TJ Junction temperature Junction temperature -40 140 °C Tstg Storage temperature(2) Storage temperature(2) –40 150 °C (1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime. (2) Higher temperatures may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow temperatures not higher than classified on the device label on the shipping boxes or reels. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/ JEDEC JS-001, all pins(1) ±2000 V Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VDD Supply voltage 1.71 3.6 V VBAT At VBAT pin, with respect to VSS 1.62 3.6 V VCORE Voltage on VCORE pin in Run/Sleep mode (2) 1.35 V Voltage on VCORE pin in Stop/Standby mode (2) 1.1 V CVDD Capacitor connected betwen VDD and VSS (1) 10 uF CVBAT Capacitor connected between VBAT and VSS 1 µF CVCORE Capacitor connected between VCORE and VSS (1) (2) 2.2 µF TA Ambient temperature –40 125 °C MSPM33C321A, MSPM33C3219 SLASFB6A – DECEMBER 2025 – REVISED SEPTEMBER 2026 www.ti.com 42 Submit Document Feedback Copyright © 2026 Texas Instruments Incorporated Product Folder Links: MSPM33C321A MSPM33C3219 |
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