SPC574K72E5 datasheet(24/127 Pages) STMICROELECTRONICS

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Electrical characteristics

SPC574Kxx

24/127

DocID023601 Rev 5

3.4

Electrostatic discharge (ESD)

The following table describes the ESD ratings of the device.

STORAGE

—

Maximum storage time, assembled

part programmed in ECU

No supply; storage

temperature in range –40

°C to 85 °C

—20

years

TSDR

Maximum solder temperature(12)

Pb-free package

——

260

°C

MSL

Moisture sensitivity level(13)

——

—

tXRAY

X-ray screen time

At 80÷130 KV; 20÷50 µA;

max 1 Gy dose

—200

Functional operating conditions are given in the DC electrical specifications. Absolute maximum ratings are stress ratings

only, and functional operation at the maxima is not guaranteed. Stress beyond the listed maxima may affect device

reliability or cause permanent damage to the device.

Allowed 1.45 – 1.5 V for 60 seconds cumulative time at maximum TJ = 125 °C, remaining time as defined in note 3 and

note 4

Allowed 1.375 – 1.45 V for 10 hours cumulative time at maximum TJ = 125 °C, remaining time as defined in note 4

1.32 – 1.375 V range allowed periodically for supply with sinusoidal shape and average supply value below 1.288 V at

maximum TJ = 125 °C

VDD_HV_IO refers to supply pins VDD_HV_IO_MAIN, VDD_HV_IO_JTAG, VDD_HV_IO_FLEX, VDD_HV_OSC, VDD_HV_FLA.

Allowed 5.5–6.0 V for 60 seconds cumulative time with no restrictions, for 10 hours cumulative time device in reset, TJ

= 125 °C, remaining time at or below 5.5 V.

Includes ADC supplies VDD_HV_ADV_S and VDD_HV_ADV_D. VDD_HV_ADV is also the supply for the device temperature

sensor and bandgap reference.

The maximum input voltage on an I/O pin tracks with the associated I/O supply maximum. For the injection current

condition on a pin, the voltage equals the supply plus the voltage drop across the internal ESD diode from I/O pin to supply.

The diode voltage varies significantly across process and temperature, but a value of 0.3V can be used for nominal

calculations.

VDD_HV_IO/VSS_HV_IO refers to supply pins and corresponding grounds: VDD_HV_IO_MAIN, VDD_HV_IO_FLEX, VDD_HV_IO_JTAG,

VDD_HV_OSC, VDD_HV_FLA.

10. Relative value can be exceeded if design measures are taken to ensure injection current limitation (parameters IINJD and

IINJA).

11. Sum of all controller pins (including both digital and analog) must not exceed 200 mA. A VDD_HV_IO power segment is

defined as one or more GPIO pins located between two VDD_HV_IO supply pins.

12. Solder profile per IPC/JEDEC J-STD-020D.

13. Moisture sensitivity per JEDEC test method A112.

Table 7. Absolute maximum ratings(1)(Continued)

Symbol

Parameter

Conditions

Value

Unit

Min

Max

Table 8. ESD ratings(1)(2)

Parameter

Conditions

Value

Unit

ESD for Human Body Model (HBM)(3)

All pins

2000

ESD for field induced Charged Device Model (CDM)(4)

All pins

500

All ESD testing is in conformity with CDF-AEC-Q100 Stress Test Qualification for Automotive Grade Integrated Circuits.

Device failure is defined as: “If after exposure to ESD pulses, the device does not meet the device specification

requirements, which includes the complete DC parametric and functional testing at room temperature and hot temperature.

Maximum DC parametrics variation within 10% of maximum specification”

SPC574K72E5 Datasheet(PDF) 24 Page - STMicroelectronics

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