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SPC574K72E5 Datasheet(PDF) 48 Page - STMicroelectronics |
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SPC574K72E5 Datasheet(HTML) 48 Page - STMicroelectronics |
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48 / 127 page ![]() Electrical characteristics SPC574Kxx 48/127 DocID023601 Rev 5 3.10.2 External oscillator (XOSC) Table 24. External Oscillator electrical specifications Symbol C Parameter Conditions Value Unit Min Max fXTAL CC D Crystal Frequency Range(1) —4 8 MHz —>8 20 —>20 40 tcst CC T Crystal start-up time (2),(3) TJ = 150 °C — 5 ms trec CC — Crystal recovery time(4) —— 0.5 ms VIHEXT CC D EXTAL input high voltage (External Reference) VREF = 0.28 * VDD_HV_IO_JTAG VREF + 0.6 —V VILEXT CC D EXTAL input low voltage(5) VREF = 0.28 * VDD_HV_IO_JTAG —VREF - 0.6 V CS_EXTAL CC T Total on-chip stray capacitance on EXTAL pin(6) QFP 6.0 8.0 pF CS_XTAL CC T Total on-chip stray capacitance on XTAL pin(8) QFP 6.0 8.0 pF gm CC P Oscillator Transconductance TJ = -40 °C to 150 °C 4.5 V < VDD_HV _IO < 5.5 V fXTAL 8 MHz 2.6 11.0 mA/V CfXTAL 20 MHz 7.9 26.0 CfXTAL 40 MHz 10.4 34.0 VEXTAL CC D Oscillation Amplitude on the EXTAL pin after startup(7) TJ = –40 °C to 150 °C 0.5 1.8 V VHYS CC D Comparator Hysteresis TJ = 150 °C 0.1 1.0 V IXTAL CC D XTAL current(8) TJ = 150 °C — 14 mA 1. The range is selectable by UTEST miscellaneous DCF clients XOSC_LF_EN and XOSC_EN_40 MHz. 2. This value is determined by the crystal manufacturer and board design. 3. Proper PC board layout procedures must be followed to achieve specifications. 4. Crystal recovery time is the time for the oscillator to settle to the correct frequency after adjustment of the integrated load capacitor value. 5. Applies to an external clock input and not to crystal mode. 6. See crystal manufacturer’s specification for recommended load capacitor (CL) values.The external oscillator requires external load capacitors when operating from 8 MHz to 16 MHz. Account for on-chip stray capacitance (CS_EXTAL/CS_XTAL) and PCB capacitance when selecting a load capacitor value. When operating at 20 MHz/40 MHz, the integrated load capacitor value is selected via S/W to match the crystal manufacturer’s specification, while accounting for on-chip and PCB capacitance. 7. Amplitude on the EXTAL pin after startup is determined by the ALC block, i.e., the Automatic Level Control Circuit. The function of the ALC is to provide high drive current during oscillator startup, but reduce current after oscillation in order to reduce power, distortion, and RFI, and to avoid over-driving the crystal. The operating point of the ALC is dependent on the crystal value and loading conditions. 8. IXTAL is the oscillator bias current out of the XTAL pin with both EXTAL and XTAL pins grounded. This is the maximum current during startup of the oscillator. The current after oscillation is typically in the 2-3 mA range and is dependent on the load and series resistance of the crystal. Test circuit is shown in Figure 12. The ALC block is the Automatic Level Control Circuit. The function of the ALC is to provide high drive current during oscillator startup, but reduce current after oscillation in order to reduce power, distortion, and RFI, and to avoid overdriving the crystal. |
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