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SPC574K72E5 Datasheet(PDF) 48 Page - STMicroelectronics

Part # SPC574K72E5
Description  32-bit Power Architecture based MCU for automotive applications
PDF  127 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

SPC574K72E5 Datasheet(HTML) 48 Page - STMicroelectronics

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Electrical characteristics
SPC574Kxx
48/127
DocID023601 Rev 5
3.10.2
External oscillator (XOSC)
Table 24. External Oscillator electrical specifications
Symbol
C
Parameter
Conditions
Value
Unit
Min
Max
fXTAL
CC
D Crystal Frequency
Range(1)
—4
8
MHz
—>8
20
—>20
40
tcst
CC
T Crystal start-up time (2),(3)
TJ = 150 °C
—
5
ms
trec
CC — Crystal recovery time(4)
——
0.5
ms
VIHEXT
CC
D EXTAL input high voltage
(External Reference)
VREF = 0.28 * VDD_HV_IO_JTAG
VREF +
0.6
—V
VILEXT
CC
D EXTAL input low voltage(5) VREF = 0.28 * VDD_HV_IO_JTAG
—VREF - 0.6
V
CS_EXTAL CC T Total on-chip stray
capacitance on EXTAL
pin(6)
QFP
6.0
8.0
pF
CS_XTAL
CC
T Total on-chip stray
capacitance on XTAL pin(8)
QFP
6.0
8.0
pF
gm
CC
P Oscillator
Transconductance
TJ = -40 °C to
150 °C
4.5 V < VDD_HV
_IO < 5.5 V
fXTAL 8 MHz
2.6
11.0
mA/V
CfXTAL 20 MHz
7.9
26.0
CfXTAL 40 MHz
10.4
34.0
VEXTAL
CC
D Oscillation Amplitude on
the EXTAL pin after
startup(7)
TJ = –40 °C to 150 °C
0.5
1.8
V
VHYS
CC
D Comparator Hysteresis
TJ = 150 °C
0.1
1.0
V
IXTAL
CC
D XTAL current(8)
TJ = 150 °C
—
14
mA
1.
The range is selectable by UTEST miscellaneous DCF clients XOSC_LF_EN and XOSC_EN_40 MHz.
2.
This value is determined by the crystal manufacturer and board design.
3.
Proper PC board layout procedures must be followed to achieve specifications.
4.
Crystal recovery time is the time for the oscillator to settle to the correct frequency after adjustment of the integrated load
capacitor value.
5.
Applies to an external clock input and not to crystal mode.
6.
See crystal manufacturer’s specification for recommended load capacitor (CL) values.The external oscillator requires
external load capacitors when operating from 8 MHz to 16 MHz. Account for on-chip stray capacitance (CS_EXTAL/CS_XTAL)
and PCB capacitance when selecting a load capacitor value. When operating at 20 MHz/40 MHz, the integrated load
capacitor value is selected via S/W to match the crystal manufacturer’s specification, while accounting for on-chip and PCB
capacitance.
7.
Amplitude on the EXTAL pin after startup is determined by the ALC block, i.e., the Automatic Level Control Circuit. The
function of the ALC is to provide high drive current during oscillator startup, but reduce current after oscillation in order to
reduce power, distortion, and RFI, and to avoid over-driving the crystal. The operating point of the ALC is dependent on the
crystal value and loading conditions.
8.
IXTAL is the oscillator bias current out of the XTAL pin with both EXTAL and XTAL pins grounded. This is the maximum
current during startup of the oscillator. The current after oscillation is typically in the 2-3 mA range and is dependent on the
load and series resistance of the crystal. Test circuit is shown in Figure 12. The ALC block is the Automatic Level Control
Circuit. The function of the ALC is to provide high drive current during oscillator startup, but reduce current after oscillation
in order to reduce power, distortion, and RFI, and to avoid overdriving the crystal.



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