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PDP83TG720SWCSTQ1 Datasheet(PDF) 194 Page - Texas Instruments |
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PDP83TG720SWCSTQ1 Datasheet(HTML) 194 Page - Texas Instruments |
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194 / 199 page  A A www.ti.com PACKAGE OUTLINE 6.1 5.9 6.1 5.9 1.0 0.8 0.05 0.00 2X 4 32X 0.5 2X 4 36X 0.5 0.3 36X 0.31 0.19 3.7 0.1 0.1 MIN (0.2) TYP (0.13) (0.16) TYP VQFN - 1 mm max height RHA0036A PLASTIC QUAD FLATPACK - NO LEAD 4225089/A 06/2019 0.08 C 0.1 C A B 0.05 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. PIN 1 INDEX AREA SEATING PLANE PIN 1 ID SYMM EXPOSED THERMAL PAD SYMM 1 9 10 18 19 27 28 36 37 SCALE 2.000 A-A 40.000 SECTION A-A TYPICAL A B C DP83TG720S-Q1 SNLS604 – SEPTEMBER 2020 www.ti.com 194 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated |
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