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TAS5822MDCPR Datasheet(PDF) 81 Page - Texas Instruments |
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TAS5822MDCPR Datasheet(HTML) 81 Page - Texas Instruments |
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81 / 90 page ![]() manufacturing issues. Instead, the solder is applied to the board in multiple apertures, to allow the solder paste to out gas during the assembly process and reduce the risk of solder bridging under the device. This structure is called an aperture array, and is shown in the Section 10.2 section. It is important that the total area of the aperture array (the area of all of the small apertures combined) covers between 70% and 80% of the area of the thermal pad itself. 10.2 Layout Example Top Layer 3D layout Bot Layer 3D layout Figure 10-1. 2.0 (Stereo BTL) 3-D View www.ti.com TAS5822M SLASEV8 – DECEMBER 2020 Copyright © 2020 Texas Instruments Incorporated Submit Document Feedback 81 Product Folder Links: TAS5822M |
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