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MCIMX6DP6AYM2AB Datasheet(PDF) 7 Page - NXP Semiconductors

Part # MCIMX6DP6AYM2AB
Description  i.MX 6DualPlus/6QuadPlus Applications Processors Industrial Products
PDF  160 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

MCIMX6DP6AYM2AB Datasheet(HTML) 7 Page - NXP Semiconductors

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Introduction
i.MX 6DualPlus/6QuadPlus Applications Processors Industrial Products, Rev. 3, 11/2018
NXP Semiconductors
7
The i.MX 6DualPlus/6QuadPlus processors use dedicated hardware accelerators to meet the targeted
multimedia performance. The use of hardware accelerators is a key factor in obtaining high performance
at low power consumption numbers, while having the CPU core relatively free for performing other tasks.
The i.MX 6DualPlus/6QuadPlus processors incorporate the following hardware accelerators:
•
VPU—Video Processing Unit
•
IPUv3H—Image Processing Unit version 3H (2 IPUs)
•
GPU3Dv6—3D Graphics Processing Unit (OpenGL ES 3.0) version 6
•
GPU2Dv3—2D Graphics Processing Unit (BitBlt) version 3
•
GPUVG—OpenVG 1.1 Graphics Processing Unit
•
4 x PRE—Prefetch and Resolve Engine
•
2 x PRG—Prefetch and Resolve Gasket
•
ASRC—Asynchronous Sample Rate Converter
Security functions are enabled and accelerated by the following hardware:
•
Arm TrustZone including the TZ architecture (separation of interrupts, memory mapping, etc.)
•
SJC—System JTAG Controller. Protecting JTAG from debug port attacks by regulating or blocking
the access to the system debug features.
•
CAAM—Cryptographic Acceleration and Assurance Module, containing 16 KB secure RAM and
True and Pseudo Random Number Generator (NIST certified)
•
SNVS—Secure Non-Volatile Storage, including Secure Real Time Clock
•
CSU—Central Security Unit. Enhancement for the IC Identification Module (IIM). Will be
configured during boot and by eFUSEs and will determine the security level operation mode as
well as the TZ policy.
•
A-HAB—Advanced High Assurance Boot—HABv4 with the new embedded enhancements:
SHA-256, 2048-bit RSA key, version control mechanism, warm boot, CSU, and TZ initialization.
1.3
Signal Naming Convention
Throughout this document, the updated signal names are used except where referenced as a ball name
(such as the Functional Contact Assignments table, Ball Map table, and so on). A master list of the signal
name changes is in the document, IMX 6 Series Standardized Signal Name Map (EB792). This list can be
used to map the signal names used in older documentation to the new standardized naming conventions.
The signal names of the i.MX6 series of products are standardized to align the signal names within the
family and across the documentation. Benefits of this standardization are as follows:
•
Signal names are unique within the scope of an SoC and within the series of products
•
Searches will return all occurrences of the named signal
•
Signal names are consistent between i.MX 6 series products implementing the same modules
•
The module instance is incorporated into the signal name
This standardization applies only to signal names. The ball names are preserved to prevent the need to
change schematics, BSDL models, IBIS models, and so on.



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