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PIC12C67X Datasheet(PDF) 93 Page - Microchip Technology |
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PIC12C67X Datasheet(HTML) 93 Page - Microchip Technology |
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93 / 129 page ![]() © 1999 Microchip Technology Inc. DS30561B-page 93 PIC12C67X LP Oscillator Operating Frequency INTRC/EXTRC Oscillator Operating Frequency XT Oscillator Operating Frequency HS Oscillator Operating Frequency FOSC 0 — 0 0 200 4(6) 4 10 kHz MHz MHz MHz All temperatures All temperatures All temperatures All temperatures * These parameters are characterized but not tested. Note 1: Data in Typical ("Typ") column is based on characterization results at 25°C. This data is for design guidance only and is not tested. 2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to VSS, T0CKI = VDD, MCLR = VDD; WDT disabled. b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode. 4: For EXTRC osc configuration, current through REXT is not included. The current through the resistor can be estimated by the formula: Ir = VDD/2REXT (mA) with REXT in kOhm. 5: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS. 6: INTRC calibration value is for 4MHz nominal at 5V, 25°C. DC CHARACTERISTICS Standard Operating Conditions (unless otherwise specified) Operating Temperature 0°C ≤ TA ≤ +70°C (commercial) –40°C ≤ TA ≤ +85°C (industrial) –40°C ≤ TA ≤ +125°C (extended) Parm No. Characteristic Sym Min Typ(1) Max Units Conditions |
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