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PIC12C67X Datasheet(PDF) 94 Page - Microchip Technology |
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PIC12C67X Datasheet(HTML) 94 Page - Microchip Technology |
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94 / 129 page  PIC12C67X DS30561B-page 94 © 1999 Microchip Technology Inc. 12.2 DC Characteristics: PIC12LC671/672 (Commercial, Industrial) PIC12LCE673/674 (Commercial, Industrial) DC CHARACTERISTICS Standard Operating Conditions (unless otherwise specified) Operating temperature 0°C ≤ TA ≤ +70°C (commercial) –40°C ≤ TA ≤ +85°C (industrial) Param No. Characteristic Sym Min Typ† Max Units Conditions D001 Supply Voltage VDD 2.5 5.5 V D002 RAM Data Retention Voltage(2) VDR 1.5* V Device in SLEEP mode D003 VDD Start Voltage to ensure Power-on Reset VPOR VSS V See section on Power-on Reset for details D004 VDD Rise Rate to ensure Power-on Reset SVDD 0.05* V/ms See section on Power-on Reset for details D010 D010C D010A Supply Current(3) IDD — — — 0.4 0.4 15 2.1 2.1 33 mA mA µA FOSC = 4MHz, VDD = 2.5V XT and EXTRC mode (Note 4) FOSC = 4MHz, VDD = 2.5V INTRC mode (Note 6) FOSC = 32kHz, VDD = 2.5V, WDT disabled LP mode, Industrial Temperature D020 D021 D021B Power-down Current(5) IPD — — 0.2 0.2 5 6 µA µA VDD = 2.5V, Commercial VDD = 2.5V, Industrial Watchdog Timer Current ∆IWDT —2.0 2.0 4 6 µA µA VDD = 2.5V, Commercial VDD = 2.5V, Industrial LP Oscillator Operating Frequency INTRC/EXTRC Oscillator Operating Frequency XT Oscillator Operating Frequency HS Oscillator Operating Frequency FOSC 0 — 0 0 200 4(6) 4 10 kHz MHz MHz MHz All temperatures All temperatures All temperatures All temperatures * These parameters are characterized but not tested. Note 1: Data in Typical ("Typ") column is based on characterization results at 25°C. This data is for design guidance only and is not tested. 2: This is the limit to which VDD can be lowered in SLEEP mode without losing RAM data. 3: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus loading, oscillator type, bus rate, internal code execution pattern, and temperature also have an impact on the current consumption. a) The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tristated, pulled to VSS, T0CKI = VDD, MCLR = VDD; WDT disabled. b) For standby current measurements, the conditions are the same, except that the device is in SLEEP mode. 4: For EXTRC osc configuration, current through REXT is not included. The current through the resistor can be estimated by the formula: Ir = VDD/2REXT (mA) with REXT in kOhm. 5: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to VDD or VSS. 6: INTRC calibration value is for 4MHz nominal at 5V, 25°C. |
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