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UJA1075TW/5V0/WD Datasheet(PDF) 28 Page - NXP Semiconductors |
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UJA1075TW/5V0/WD Datasheet(HTML) 28 Page - NXP Semiconductors |
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28 / 53 page ![]() UJA1075_2 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 02 — 27 May 2010 28 of 53 NXP Semiconductors UJA1075 High-speed CAN/LIN core system basis chip 7. Limiting values Table 8. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Vx voltage on pin x DC value pins V1, V2 and INTN −0.3 7 V pins TXDC, RXDC, EN, SDI, SDO, SCK, SCSN, TXDL, RXDL, RSTN and WDOFF −0.3 VV1 + 0.3 V pin VEXCC VV1 − 0.3 VV1 + 0.35 V pins WAKE1, WAKE2 and WBIAS; with respect to any other pin −58 +58 V pin LIMP and BAT −0.3 +40 V pin VEXCTRL −0.3 VBAT + 0.3 V pins CANH, CANL, SPLIT and LIN; with respect to any other pin −58 +58 V pin DLIN; with respect to any other pin VBAT − 0.3 +58 V IR(V1-BAT) reverse current from pin V1 to pin BAT VV1 ≤ 5V [1] - 250 mA IDLIN current on pin DLIN −65 0 mA Vtrt transient voltage on pins BAT: via reverse polarity diode/capacitor CANL, CANH, SPLIT: coupling with two capacitors on the bus lines LIN: coupling via 1 nF capacitor DLIN: via 1 k Ω resistor [2] −150 +100 V VESD electrostatic discharge voltage IEC 61000-4-2 [3] pins BAT with capacitor, CANH, CANL and LIN; via a series resistor on pins SPLIT, DLIN, WAKE1 and WAKE2 [4] −6+6 kV HBM [5] pins CANH, CANL, LIN, SPLIT, DLIN, WAKE1 and WAKE2 [6] −8+8 kV pin BAT; referenced to ground −4+4 kV pin TEST2; referenced to pin BAT −1.25 +2 kV pin TEST2; referenced to other reference pins −2+2 kV any other pin −2+2 kV MM [7] any pin −300 +300 V CDM [8] corner pins −750 +750 V any other pin −500 +500 V Tvj virtual junction temperature [9] −40 +150 °C Tstg storage temperature −55 +150 °C |
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