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UJA1075TW/5V0/WD Datasheet(PDF) 49 Page - NXP Semiconductors |
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UJA1075TW/5V0/WD Datasheet(HTML) 49 Page - NXP Semiconductors |
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49 / 53 page ![]() UJA1075_2 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 02 — 27 May 2010 49 of 53 NXP Semiconductors UJA1075 High-speed CAN/LIN core system basis chip For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. MSL: Moisture Sensitivity Level Fig 21. Temperature profiles for large and small components 001aac844 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = MSL limit, damage level peak temperature |
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