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PAC1941T-1E/4MX. Datasheet(PDF) 86 Page - Microchip Technology |
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PAC1941T-1E/4MX. Datasheet(HTML) 86 Page - Microchip Technology |
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86 / 96 page ![]() PAC194X DS20006543A-page 86 2021 Microchip Technology Inc. RECOMMENDED LAND PATTERN Dimension Limits Units C2 Optional Center Pad Width Contact Pad Spacing Optional Center Pad Length Contact Pitch Y2 X2 1.20 1.20 MILLIMETERS 0.50 BSC MIN E MAX 2.90 Contact Pad Length (X16) Contact Pad Width (X16) Y1 X1 0.80 0.30 NOM C1 Contact Pad Spacing 2.90 Contact Pad to Contact Pad (X12) G2 0.20 Thermal Via Diameter V 0.33 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process 1. 2. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: Contact Pad to Center Pad (X16) G1 0.45 Microchip Technology Drawing C04-2508 Rev A C1 C2 X2 Y2 X1 Y1 G1 G2 ØV E SILK SCREEN 16-Lead Very Thin Quad Flat, No Lead Package (4MX) - 3x3x0.9 mm Body [VQFN] With 1.10 mm Exposed Pad and Stepped Wettable Flanks |
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