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MYX29GL01GS11DPIV2 Datasheet(PDF) 60 Page - Micross Components

Part # MYX29GL01GS11DPIV2
Description  Tin-lead ball metallurgy
PDF  68 Pages
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Manufacturer  MICROSS [Micross Components]
Direct Link  http://www.micross.com
Logo MICROSS - Micross Components

MYX29GL01GS11DPIV2 Datasheet(HTML) 60 Page - Micross Components

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MYX29GL01GS11DPIV2
Revision 1.0 - 01/26/2015
*Advanced information. Subject to change without notice.
60
1Gb GL-S MirrorBit® Eclipse™
Flash Memory
MYX29GL01GS11DPIV2*
Form #: CSI-D-685 Document 001
Figure 17: Read to Write (CE# VIL) Operation Timing Diagram
October 9, 2013 S29GL_128S_01GS_00_08
GL-S MirrorBit® Family
85
Data She e t
Figure 10.11 Write to Read (tCE) Operation Timing Diagram
Figure 10.12 Read to Write (CE# VIL) Operation Timing Diagram
Amax-A0
CE#
OE#
WE#
DQ15-DQ0
tACC
tOE
tOEH
tCE
tDF
tDF
tOH
tOH
tOH
tAS
tAH
tDS
tDH
tWP
tCS
tCH
tSR_W
Amax-A0
CE#
OE#
WE#
DQ15-DQ0
tAS
tDS
tAH
tDH
tCH
tACC
tCE
tOE
tOH
tOH
tDF
tWP
tGHWL
Figure 18: Read to Write (CE# Toggle) Operation Timing Diagram
86
GL-S MirrorBit® Family
S29GL_128S_01GS_00_08 October 9, 2013
D a t a S h e e t
Figure 10.13 Read to Write (CE# Toggle) Operation Timing Diagram
Notes:
1. Not 100% tested.
2. Upon the rising edge of WE#, must wait tSR/W before switching to another address.
3. See Table 5.4 on page 46 and Table 5.5 on page 47 for specific values.
Table 10.8 Erase/Program Operations
Parameter
Description
VIO = 2.7V
to VCC
VIO = 1.65V
to VCC
Unit
JEDEC
Std
tWHWH1
tWHWH1
Write Buffer Program Operation
Typ
(Note 3)
µs
Effective Write Buffer Program Operation per Word
Typ
(Note 3)
µs
Program Operation per Word or Page
Typ
(Note 3)
µs
tWHWH2
tWHWH2
Sector Erase Operation (Note 1)
Typ
(Note 3)
ms
tBUSY
Erase/Program Valid to RY/BY# Delay
Max
80
ns
tSR/W
Latency between Read and Write operations (Note 2)
Min
10
ns
tESL
Erase Suspend Latency
Max
(Note 3)
µs
tPSL
Program Suspend Latency
Max
(Note 3)
µs
tRB
RY/BY# Recovery Time
Min
0
µs
Amax-A0
CE#
OE#
WE#
DQ15-DQ0
tACC
tOE
tCE
tAS
tCS
tDS
tAH
tDH
tWP
tCH
tOH
tOH
tOH
tDF
tDF
tGHWL



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