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MYX29GL01GS11DPIV2 Datasheet(PDF) 66 Page - Micross Components

Part # MYX29GL01GS11DPIV2
Description  Tin-lead ball metallurgy
PDF  68 Pages
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Manufacturer  MICROSS [Micross Components]
Direct Link  http://www.micross.com
Logo MICROSS - Micross Components

MYX29GL01GS11DPIV2 Datasheet(HTML) 66 Page - Micross Components

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MYX29GL01GS11DPIV2
Revision 1.0 - 01/26/2015
*Advanced information. Subject to change without notice.
66
1Gb GL-S MirrorBit® Eclipse™
Flash Memory
MYX29GL01GS11DPIV2*
Form #: CSI-D-685 Document 001
11 .2
Physical Diagram – LAE064
Figure 24: LAE064 - 64-ball Fortified Ball Grid Array (FBGA), 9 x 9 mm
94
GL-S MirrorBit® Family
S29GL_128S_01GS_00_08 October 9, 2013
D a t a S h e e t
11.2.2
Physical Diagram – LAE064
Figure 11.4 LAE064—64-ball Fortified Ball Grid Array (FBGA), 9 x 9 mm
PACKAGE
LAE 064
JEDEC
N/A
9.00 mm x 9.00 mm
PACKAGE
SYMBOL
MIN
NOM
MAX
NOTE
A
---
---
1.40
PROFILE HEIGHT
A1
0.40
---
---
STANDOFF
A2
0.60
---
---
BODY THICKNESS
D
9.00 BSC.
BODY SIZE
E
9.00 BSC.
BODY SIZE
D1
7.00 BSC.
MATRIX FOOTPRINT
E1
7.00 BSC.
MATRIX FOOTPRINT
MD
8
MATRIX SIZE D DIRECTION
ME
8
MATRIX SIZE E DIRECTION
N
64
BALL COUNT
b
0.50
0.60
0.70
BALL DIAMETER
eD
1.00 BSC.
BALL PITCH - D DIRECTION
eE
1.00 BSC.
BALL PITCH - E DIRECTION
SD / SE
0.50 BSC.
SOLDER BALL PLACEMENT
?
NONE
DEPOPULATED SOLDER BALLS
3623 \ 16-038.12 \ 1.16.07
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010?
EXCEPT AS NOTED).
4. e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7 SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN ?
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF
DEPOPULATED BALLS.



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