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MYX29GL01GS11DPIV2 Datasheet(PDF) 64 Page - Micross Components

Part # MYX29GL01GS11DPIV2
Description  Tin-lead ball metallurgy
PDF  68 Pages
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Manufacturer  MICROSS [Micross Components]
Direct Link  http://www.micross.com
Logo MICROSS - Micross Components

MYX29GL01GS11DPIV2 Datasheet(HTML) 64 Page - Micross Components

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MYX29GL01GS11DPIV2
Revision 1.0 - 01/26/2015
*Advanced information. Subject to change without notice.
64
1Gb GL-S MirrorBit® Eclipse™
Flash Memory
MYX29GL01GS11DPIV2*
Form #: CSI-D-685 Document 001
Figure 21: Back to Back (CE#) Write Operation Timing Diagram
October 9, 2013 S29GL_128S_01GS_00_08
GL-S MirrorBit® Family
89
Data She e t
10.4.3
Alternate CE# Controlled Write Operations
Note:
1. Not 100% tested.
Figure 10.19 Back to Back (CE#) Write Operation Timing Diagram
Table 10.9 Alternate CE# Controlled Write Operations
Parameter
Description
VIO = 2.7V to
VCC
VIO = 1.65V
to VCC
Unit
JEDEC
Std
tAVAV
tWC
Write Cycle Time (Note 1)
Min
60
ns
tAVWL
tAS
Address Setup Time
Min
0
ns
tASO
Address Setup Time to OE# Low during toggle bit polling
Min
15
ns
tWLAX
tAH
Address Hold Time
Min
45
ns
tAHT
Address Hold Time From CE# or OE# High during toggle
bit polling
Min
0
ns
tDVWH
tDS
Data Setup Time
Min
30
ns
tWHDX
tDH
Data Hold Time
Min
0
ns
tCEPH
CE# High during toggle bit polling
Min
20
ns
t0EPH
OE# High during toggle bit polling
Min
20
ns
tGHEK
tGHEL
Read Recovery Time Before Write
(OE# High to WE# Low)
Min
0
ns
tWLEL
tWS
WE# Setup Time
Min
0
ns
tELWH
tWH
WE# Hold Time
Min
0
ns
tELEH
tCP
CE# Pulse Width
Min
25
ns
tEHEL
tCPH
CE# Pulse Width High
Min
20
ns
Amax-A0
CE#
OE#
WE#
DQ15-DQ0
tDS
tDH
tAS
tAH
tWC
tCP
tCPH
tWS
tWH
Figure 22: (CE#) Write to Read Operation Timing Diagram
90
GL-S MirrorBit® Family
S29GL_128S_01GS_00_08 October 9, 2013
D a t a S h e e t
Figure 10.20 (CE#) Write to Read Operation Timing Diagram
Amax-A0
CE#
OE#
WE#
DQ15-DQ0
tACC
tOE
tCE
tDF
tOH
tWC
tAS
tAH
tDS
tDH
tWS
tWH
tOEH



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