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HC805K3GRS/D Datasheet(PDF) 115 Page - NXP Semiconductors |
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HC805K3GRS/D Datasheet(HTML) 115 Page - NXP Semiconductors |
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115 / 119 page ![]() MC68HC805K3 — Rev. 1.0 Mechnical Specifications 115 General Release Specification — MC68HC805K3 Section 13. Mechnical Specifications 13.1 Contents 13.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .115 13.3 Dual-In-Line Package (Case 648) . . . . . . . . . . . . . . . . . . . . .116 13.4 Small Outline Integrated Circuit (Case 751) . . . . . . . . . . . . . .116 13.2 Introduction The MC68HC805K3 is available in the following packages: • 648 — Plastic dual in-line package (PDIP) • 751 — Small outline integrated circuit (SOIC) The following figures show the latest packages at the time of this publication. To make sure that you have the latest package specifications, contact one of the following: • Local Motorola Sales Office • Motorola Mfax – Phone 602-244-6609 – EMAIL rmfax0@email.sps.mot.com • Worldwide Web (wwweb) at http://design-net.com Follow Mfax or wwweb on-line instructions to retrieve the current mechanical specifications. Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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