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HC805K3GRS/D Datasheet(PDF) 116 Page - NXP Semiconductors |
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HC805K3GRS/D Datasheet(HTML) 116 Page - NXP Semiconductors |
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116 / 119 page ![]() General Release Specification Dual-In-Line Package (Case 648) MC68HC805K3 — Rev. 1.0 116 Mechnical Specifications 13.3 Dual-In-Line Package (Case 648) 13.4 Small Outline Integrated Circuit (Case 751) -A- B F C S H G D 16 PL J L M SEATING PLANE 18 9 16 K -T- M A M 0.25 (0.010) T DIM MIN MAX MIN MAX MILLIMETERS INCHES A 0.740 0.770 18.80 19.55 B 0.250 0.270 6.35 6.85 C 0.145 0.175 3.69 4.44 D 0.015 0.021 0.39 0.53 F 0.040 0.70 1.02 1.77 G 0.100 BSC 2.54 BSC H 0.050 BSC 1.27 BSC J 0.008 0.015 0.21 0.38 K 0.110 0.130 2.80 3.30 L 0.295 0.305 7.50 7.74 M 0 ° 10 ° 0 ° 10 ° S 0.020 0.040 0.51 1.01 F J DIM MIN MAX MIN MAX INCHES MILLIMETERS A 10.15 10.45 0.400 0.411 B 7.40 7.60 0.292 0.299 C 2.35 2.65 0.093 0.104 D 0.35 0.49 0.014 0.019 F 0.50 0.90 0.020 0.035 G 1.27 BSC 0.050 BSC J 0.25 0.32 0.010 0.012 K 0.10 0.25 0.004 0.009 M 0 ° 7 ° 0 ° 7 ° P 10.05 10.55 0.395 0.415 R 0.25 0.75 0.010 0.029 M B M 0.010 (0.25) -A- -B- P 8X G 14X D 16X SEATING PLANE -T- S A M 0.010 (0.25) B S T 16 9 8 1 R X 45 M C K Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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