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S32K311NHT0MPAST Datasheet(PDF) 21 Page - NXP Semiconductors

Part # S32K311NHT0MPAST
Description  Automotive General Purpose MCUs
PDF  143 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

S32K311NHT0MPAST Datasheet(HTML) 21 Page - NXP Semiconductors

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Table 3. Voltage and current operating requirements (continued)
Symbol
Description
Min
Typ
Max
Unit
Condition
Spec
Number
VGPIO
Input voltage range
at any I/O or analog
pin 1,7
-0.3
VDD_HV
_A/B +
0.3
V
VODPU
Open-drain pull-up
voltage 1,8
VDD_HV
_A/B
V
IINJPAD_DC_OP
Continuous DC input
current (positive/
negative) that can be
injected into an I/O
pin 9
-3
3
mA
VDD_HV_A >= 3.6V
IINJPAD_DC_OP
Continuous DC input
current (positive/
negative) that can be
injected into an I/O
pin 9
-2
3
mA
VDD_HV_A >= 2.97V
IINJSUM_DC_OP
Sum of
absolute value of
injected currents
on all the I/O
pins (continuous
DC limit) 9,10
-30
30
mA
VDD_HV_A >= 3.6V
IINJSUM_DC_OP
Sum of
absolute value of
injected currents
on all the I/O
pins (continuous
DC limit) 9,10
-20
30
mA
VDD_HV_A >= 2.97V
Vramp_slow
Supply ramp rate
(slow) 1,11
0.5
V/min
Vramp_fast
Supply ramp rate
(fast) 1,11
100
V/ms
1. All voltages are referred to VSS unless otherwise specified.
2. Voltage at VDD_DCDC cannot be higher than VDD_HV_A.
3. Min and Max values are applicable only for non-SMPS mode where V15 is sourced externally.
4. If total power dissipation and maximum junction temperature allows. Please refer to Thermal operating characteristics
table for the maximum junction temperature, and Thermal characteristics table for the thermal characteristics, to determine
the maximum power dissipation allowed for a given package.
5. You must ensure that the junction temperature in the application must not exceed the maximum specified Tj.
6. VREFH should always be equal to or less than VDD_HV_A +0.1. Any positive differential voltage between VREFH and
VDD_HV_A i.e., VDD_HV_A < VREFH <= VDD_HV_A + 0.1V) is for RF-AC only. Appropriate decoupling capacitors should
be used to filter noise on the supplies. See application note AN5032 for reference supply design for SAR ADC
7. Keeping the input voltage between this range practically ensures that no (noticeable) current is being injected. When
exceeding these limits, the current being injected must be lower than IINJPAD_DC_OP, all the time.
8. Open-drain outputs must be pulled respectively to their supply rail (VDD_HV_A or VDD_HV_B).
9. When the input pad voltage levels are close to VDD_HV_A (respectively to VDD_HV_B) or VSS, plus /minus the forward
voltage of ESD diodes, practically, no current is being injected. When these limits are exceeded, the maximum input
current spec must be honored. Refer to the S32K3 Hardware Design Guidelines AN for more details and recommendations
for protecting the devices against injection current.
NXP Semiconductors
General
S32K3xx Data Sheet, Rev. 9.1, 03/2024
Data Sheet: Technical Data
Preliminary Information for S32K388
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