S32K311NHT0MPAST datasheet(51/143 Pages) NXP

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Table 16. Low speed RUN mode supply currents (continued)

125,

max 8, 9, 10

79.8

66.9

90.1

S32K311,

S32K310

25, typ 7

12.9

4.4

22.4

25, max 8

14.9

6.0

24.8

85, typ 7

16.0

7.5

25.6

85, max 8

31.0

22.2

41.1

105, typ 7

19.1

10.5

28.7

105, max 8 45.8

36.8

55.6

125, typ 7

25.2

16.5

34.7

125,

max 8, 9, 10

73.2

64.3

82.4

1. Current numbers are for reduced configuration and may vary based on user configuration and silicon process variation.

2. See the example configurations in Table 21

3. IO load current is not included. The actual current requirements for IOs will depend on the I/O configuration in the

application.

4. RUN IDD @ VDD_HV_A includes Flash memory read current from the V25 voltage rail.

5. RUN IDD @ V15 includes Flash memory read current from the V11 voltage rail

6. For S32K388, the current from a V15 supply will flow through the external NMOS for the V11 regulation stage, and into the

V11 pins of the device.

7. “typ” is indicative of the average current numbers at the nominal internally regulated V11 supply voltage, VDD_HV_A =

5.0V, VDD_HV_B = 5.0V, V15 = 1.5V, for the typical silicon process.

8. “max” is indicative of the maximum current numbers at the maximum internally regulated V11 supply voltage (1.16 V),

VDD_HV_A = 5.5V, VDD_HV_B = 5.5V, V15 = 1.65V, for the fast silicon process.

9. For the maximum allowable RUN current in an application, the junction temperature must be kept below the maximum

specification, TJ < 150°C, to avoid self-heating.

10. If the total power dissipation would cause the junction temperature to be exceeded when VDD_HV_A is at 5V, then

VDD_HV_A should be limited to operate at 3.3V.

All data in this table is preliminary and based on first samples.

NOTE

Typical current numbers are indicative for typical silicon process and may vary based on the silicon distribution and user

configuration. Typical conditions assumes VDD_HV_A = VREFH = 5 V, VDD_HV_B = 5V (if the VDD_HV_B domain present in the

device), temperature = 25 °C and typical silicon process unless otherwise stated.

Table 17. RUN mode supply currents (peripherals disabled) for S32K3x8, S32K34x, S32K32x and S32K314

Chip

Ambient

Temperature

(°C)

RUN Mode (mA) 1

Table continues on the next page...

NXP Semiconductors

Power management

S32K3xx Data Sheet, Rev. 9.1, 03/2024

Data Sheet: Technical Data

Preliminary Information for S32K388

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