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JS48F4400P0P3C0 Datasheet(PDF) 34 Page - Numonyx B.V |
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JS48F4400P0P3C0 Datasheet(HTML) 34 Page - Numonyx B.V |
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34 / 139 page ![]() Numonyx™ StrataFlash® Cellular Memory (M18) Datasheet April 2008 34 309823-10 F-ADV2# ADV# Input FLASH ADDRESS VALID: Flash-specific signal; low-true input. During AAD-Mux flash accesses, the upper address is latched on the valid edge of CLK while F-ADV2# is low; the lower address is latched on the valid edge of CLK while ADV# is low. The upper address is always latched first, followed by the lower address. Control Signals F[4:1]-CE# Input FLASH CHIP ENABLE: Flash-specific signal; low-true input. When low, F-CE# selects the associated flash memory die. When high, F-CE# deselects the associated flash die. Flash die power is reduced to standby levels, and its data and F-WAIT outputs are placed in a High-Z state. • F1-CE# is dedicated to flash die #1. • F[4:2]-CE# are dedicated to flash die #4 through #2, respectively, if present. Otherwise, any unused flash chip enable should be treated as RFU. • For NOR/NAND stacked device, F1-CE# selects NOR die #1, F2-CE# selects NOR die #2 while F4-CE# selects NAND die #1 and NAND die #2 using virtual chip-select scheme, F3- CE# selects NAND die #3 if present. CLK Input CLOCK: Flash- and Synchronous PSRAM-specific input signal. CLK synchronizes the flash and/or synchronous PSRAM with the system clock during synchronous operations. F[2:1]-OE# Input FLASH OUTPUT ENABLE: Flash-specific signal; low-true input. When low, F-OE# enables the output drivers of the selected flash die. When high, F-OE# disables the output drivers of the selected flash die and places the output drivers in High-Z. • For NOR only stacked device, F[2:1]-OE# are common to all NOR dies in the device. • For NOR/NAND stacked device, F1-OE# enables all NOR dies, F2-OE# selects all NAND dies if present. 2 R-OE# Input RAM OUTPUT ENABLE: PSRAM- and SRAM-specific signal; low-true input. When low, R-OE# enables the output drivers of the selected memory die. When high, R-OE# disables the output drivers of the selected memory die and places the output drivers in High-Z. 1 F-RST# Input FLASH RESET: Flash-specific signal; low-true input. When low, F-RST# resets internal operations and inhibits writes. When high, F-RST# enables normal operation. WAIT Output WAIT: Flash -and Synchronous PSRAM-specific signal; configurable true-level output. When asserted, WAIT indicates invalid output data. When deasserted, WAIT indicates valid output data. • WAIT is driven whenever the flash or the synchronous PSRAM is selected and its output enable is low. • WAIT is High-Z whenever flash or the synchronous PSRAM is deselected, or its output enable is high. F-WE# Input FLASH WRITE ENABLE: Flash-specific signal; low-true input. When low, F-WE# enables Write operations for the enabled flash die. Address and data are latched on the rising edge of F-WE#. R-WE# Input RAM WRITE ENABLE: PSRAM- and SRAM-specific signal; low-true input. When low, R-WE# enables Write operations for the selected memory die. Data is latched on the rising edge of R-WE#. 1 F-WP[2:1]# Input FLASH WRITE PROTECT: Flash-specific signals; low-true inputs. When low, F-WP# enables the Lock-Down mechanism. When high, F-WP# overrides the Lock- Down function, enabling locked-down blocks to be unlocked with the Unlock command. • F-WP1# is dedicated to flash die #1. • F-WP2# is common to all other flash dies, if present. Otherwise it is RFU. • For NOR/NAND stacked device, F-WP1# selects all NOR dies, while F-WP2# selects all NAND dies. F-DPD Input FLASH DEEP POWER-DOWN: Flash-specific signal; configurable-true input. When enabled in the ECR, F-DPD is used to enter and exit Deep Power-Down mode. N-CLE Input NAND COMMAND LATCH ENABLE: NAND-specific signal; high-true input. When high, N-CLE enables commands to be latched on the rising edge of N-WE#. 1 Table 8: Signal Descriptions for x16C / x16C AD-Mux / x16C AA/D-Mux Ballout (Sheet 2 of 3) Symbol Type Signal Descriptions Notes |
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