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MCP37D31-80E/TE Datasheet(PDF) 5 Page - Microchip Technology

Part # MCP37D31-80E/TE
Description  80 Msps, 16/14-Bit High-Pr ecision Pipelined ADC
PDF  141 Pages
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MCP37D31-80E/TE Datasheet(HTML) 5 Page - Microchip Technology

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 2020 Microchip Technology Inc.
DS20006382A-page 5
MCP37D31-80 AND MCP37D21-80
1.0
PACKAGE PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
FIGURE 1-1:
TFBGA-121 Package. See Table 1-1 for the pin descriptions and Table 1-2 for active
and inactive ADC output pins for various ADC resolution modes.
Top View
1
2
3
4
5
6
7
8
9
10
11
SDIO VCM
REF1+ REF1-
REF0+ REF0-
AIN4-
AIN2+
SCLK
WCK/
Q14/Q7-
Q12/Q6-
Q8/Q4-
Q6/Q3-
Q2/Q1-
Q4/Q2-
Q10/Q5-
OVR-
CS
WCK/
Q15/Q7
+
Q13/Q6
+
Q11/Q5
+
Q7/Q3+
Q3/Q1+
Q9/Q4+
Q5/Q2+
OVR+
GND
GND
GND
GND
DVDD18
DVDD12
DM1/DM+
DVDD12
DVDD18
GND
GND
GND
GND
DVDD18
DVDD12
DVDD12
DVDD18
DCLK-
SENSE
AVDD12
AVDD12
AVDD12
AVDD12
AVDD12
AVDD12
AVDD12
AVDD12
AVDD12 AVDD12
AVDD12
AVDD12
AVDD12
AVDD12
AVDD12
AVDD12
AVDD18 AVDD18
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
CAL
GND
SLAVE ADR0
GND
GND
GND
GND
GND
GND
GND
ADR1
AIN4+
AIN5+
AIN5-
AIN6-
AIN6+
AIN7-
AIN7+
VCMIN+
GND
AIN3-
AIN3+
AIN1+
AIN1-
AIN0+
AIN0-
AIN2-
VCMIN-
GND
Q0/Q0- Q1/Q0+ DM2/DM- DCLK+ RESET SYNC
GND
CLK+
CLK-
GND AVDD18
GND
GND
A
B
C
D
E
F
G
H
J
K
L
(Not to Scale)
Analog
Digital
All others:
Supply Voltage
VBG
(WCK) (OVR)
Notes:
• Die dimension: 8 mm x 8 mm x 1.08 mm.
• Ball dimension: (a) Ball Pitch = 0.65 mm, (b) Ball Diameter = 0.4 mm.
• Flip-chip solder ball composition: Sn with Ag 1.8%.
• Solder sphere composition: SAC-405 (Sn/Au 4%/Cu 0.5%).



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