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LSM6DSO16IS Datasheet(PDF) 90 Page - STMicroelectronics |
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LSM6DSO16IS Datasheet(HTML) 90 Page - STMicroelectronics |
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90 / 107 page ![]() 16 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 16.1 Soldering information The LGA package is compliant with the ECOPACK and RoHS standard. It is qualified for soldering heat resistance according to JEDEC J-STD-020. For land pattern and soldering recommendations, consult technical note TN0018 available on www.st.com. 16.2 LGA-14L package information Figure 17. LGA-14L 2.5 x 3.0 x 0.86 mm package outline and mechanical data W H 4x (0.1) 14x 0.475±0.05 14x 0.25±0.05 0.5 Pin1 indicator BOTTOM VIEW TOP VIEW 1 C 0.05 C Pin 1 indicator Dimensions are in millimeter unless otherwise specified General tolerance is +/-0.1mm unless otherwise specified OUTER DIMENSIONS ITEM DIMENSION [mm] TOLERANCE [mm] 1 . 0 ± 0 5 . 2 ] L [ h t g n e L 1 . 0 ± 0 0 . 3 ] W [ h t d i W X A M 6 8 . 0 ] H [ t h g i e H DM00249496_5 LSM6DSO16IS Package information DS13892 - Rev 2 page 90/107 |
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