S32K311NHT0MPAST datasheet(122/143 Pages) NXP

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Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting

side (board) temperature, ambient temperature, air flow, power dissipation or other components on the board, and

board thermal resistance.

NOTE

14.2 Thermal characteristics

Thermal Design and Characteristics

• Junction temperature of the device does not solely depend on package thermal resistance but is also a function of chip

power dissipation, PCB attributes, environmental conditions (ambient temperature & air flow) and cumulative effects of

other heat generating ICs on the PCB.

• The appropriate thermal design must be carried out on package so that it can safely dissipate the necessary amount of

power needed for it to function properly without exceeding the maximum junction temperature. This may involve adding a

cooling solution on the package, creating thermal enhancements on the PCB and improving environmental conditions.

• The customer is encouraged to use the package model to perform design and risk assessment through simulations.

Package models in FloTHERM or Icepak formats can be obtained under NDA from the sales team.

Thermal Ratings

• The table below is the package thermal ratings for LQFP, HDQFP & MAPBGA package variants. These numbers are

derived through simulations based on standardized tests as described in the footnotes.

• Thermal resistance data in this report is solely for a thermal performance comparison of one package to another in a

standardized specified environment. It is not meant to predict the performance of a package in an application-specific

environment :

NXP Semiconductors

Thermal Attributes

S32K3xx Data Sheet, Rev. 9.1, 03/2024

Data Sheet: Technical Data

Preliminary Information for S32K388

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S32K311NHT0MPAST Datasheet(PDF) 122 Page - NXP Semiconductors