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S32K311NHT0MPAST Datasheet(PDF) 123 Page - NXP Semiconductors

Part # S32K311NHT0MPAST
Description  Automotive General Purpose MCUs
PDF  143 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

S32K311NHT0MPAST Datasheet(HTML) 123 Page - NXP Semiconductors

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Table 67. Thermal characteristics
Rating
Conditions
Symbol
Package
Device
Unit
S32K311
S32K310
S32K312 S32K342
S32K341
S32K322
S32K344
S32K314
S32K324
S32K358
S32K348
S32K328
S32K338
S32K388
Thermal resistance, Junction
to Ambient (Natural
Convection)1
Four-layer
board (2s2p)2
RϴJA
48-LQFP
45
NA
NA
NA
NA
NA
°C/W
100-HDQFP
35.3
38
33.8
NA
NA
NA
°C/W
172-HDQFP
NA
30.5
29.6
28.9
NA
NA
°C/W
257-MAPBGA
NA
NA
NA
26.8
NA
NA
°C/W
172 HDQFP_EP
NA
NA
NA
NA
15.6
NA
°C/W
289-MAPBGA
NA
NA
NA
NA
20.9
TBD
°C/W
Thermal characterization
parameter, Junction-to-Top of
package1
Natural
Convection
ΨJT
48-LQFP
2
NA
NA
NA
NA
NA
°C/W
100-HDQFP
0.66
0.8
0.5
NA
NA
NA
°C/W
172-HDQFP
NA
0.5
0.5
0.4
NA
NA
°C/W
257-MAPBGA
NA
NA
NA
0.3
NA
NA
°C/W
172 HDQFP_EP
NA
NA
NA
NA
0.3
NA
°C/W
289-MAPBGA
NA
NA
NA
NA
0.4
TBD
°C/W
1. Determined in accordance to JEDEC JESD51-2A natural convection environment. Thermal resistance data in this report is solely for a thermal performance
comparison of one package to another in a standardized specified environment. It is not meant to predict the performance of a package in an application-specific
environment
2. Thermal test board meets JEDEC specification for this package (JESD51-9).



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