MPF7100BVBA2ES datasheet(7/125 Pages) NXP

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NXP Semiconductors

PF7100

7-channel power management integrated circuit for high performance applications

PF7100

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 4 — 9 March 2021

7 / 125

9 ESD ratings

Table 5. ESD ratings

All ESD specifications are compliant with AEC-Q100 specification.

Symbol

Parameter

Min

Typ

Max

Unit

VESD

Human Body Model

[1] —

—

2000

VESD

Charge Device Model

QFN package - all pins

[1] —

—

500

ILATCHUP

Latch-up current

—

100

[1]

ESD testing is performed in accordance with the human body model (HBM) (CZAP = 100 pF, RZAP = 1500 Ω), and the charge device model (CDM),

robotic (CZAP = 4.0 pF)

10 Thermal characteristics

Table 6. Thermal characteristics

Symbol

Parameter

Min

Typ

Max

Unit

Ambient operating temperature

AEC-Q100 grade 1

−40

—

125

°C

Ambient operating temperature

AEC-Q100 grade 2

−40

—

105

°C

Junction temperature

−40

—

150

°C

TST

Storage temperature range

−55

—

150

°C

TPPRT

Peak package reflow temperature

—

260

°C

Table 7. HVQFN48 thermal resistance and package dissipation ratings

Symbol

Parameter

Min

Max

Unit

RθJA

Junction to ambient thermal resistance

Four layer board (2s2p)

[1] [2] [3] —

°C/W

RθJA

Junction to ambient thermal resistance

Eight layer board (2s6p)

[1] [2] [4] —

°C/W

ΨJT

Junction-to-top of package thermal resistance

Four layer board(2s2p)

[1] [2] [3] —

1.0

°C/W

ΨJT

Junction-to-top of package thermal resistance

Eight layer board(2s6p)

[1] [2] [4] —

1.0

°C/W

[1]

Determined in accordance to JEDEC JESD51-2A natural convection environment and uniform power.

[2]

Thermal resistance data in this report is solely for a thermal performance comparison of one package to another in a standardized specified environment.It

is not meant to predict the performance of a package in an application-specific environment.

[3]

Thermal test board meets JEDEC specification for this package (JESD51-9, 2s2p).

[4]

2s6p PCB is with customized board layers (top and bottom metal layers are at 7 μm thickness, internal metal layers are at 35 µm thickness).

11 Operating conditions

Table 8. Operating conditions

Symbol

Parameter

Min

Typ

Max

Unit

VIN

Main input supply voltage

UVDET

—

5.5

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