XC2230L datasheet(110/112 Pages) INFINEON

110 / 112 page

XC2230L, XC2234L

XC2000 Family / Econo Line

Package and Reliability

Data Sheet

106

V1.3, 2015-02

5.2

Thermal Considerations

When operating the XC223[04]L in a system, the total heat generated in the chip must

be dissipated to the ambient environment to prevent overheating and the resulting

thermal damage.

The maximum heat that can be dissipated depends on the package and its integration

into the target board. The “Thermal resistance

RΘJA” quantifies these parameters. The

power dissipation must be limited so that the average junction temperature does not

exceed 150 °C.

The difference between junction temperature and ambient temperature is determined by

ΔT = (P

INT + PIOSTAT + PIODYN) × R

ΘJA

The internal power consumption is defined as

INT = VDDP × IDDP (switching current and leakage current).

The static external power consumption caused by the output drivers is defined as

IOSTAT = Σ((VDDP-VOH) × IOH) + Σ(VOL × IOL)

The dynamic external power consumption caused by the output drivers (

IODYN) depends

on the capacitive load connected to the respective pins and their switching frequencies.

If the total power dissipation for a given system configuration exceeds the defined limit,

countermeasures must be taken to ensure proper system operation:

•

Reduce

DDP, if possible in the system

•

Reduce the system frequency

•

Reduce the number of output pins

•

Reduce the load on active output drivers

XC2230L Datasheet(PDF) 110 Page - Infineon Technologies AG