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MFS2401AVBA0ES Datasheet(PDF) 25 Page - NXP Semiconductors

Part # MFS2401AVBA0ES
Description  Fail-safe system basis chip with SMPS and LDO, CAN FD transceiver
PDF  151 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

MFS2401AVBA0ES Datasheet(HTML) 25 Page - NXP Semiconductors

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NXP Semiconductors
FS2400
Fail-safe system basis chip with SMPS and LDO, CAN FD transceiver
10 Thermal characteristics
Symbol
Description (Rating)
Min
Max
Unit
Thermal ratings
TA
Ambient temperature
-40
115
°C
TJ
Junction temperature
-40
150
°C
TSTG
Storage temperature
-55
150
°C
Thermal resistance (per JEDEC JESD51-9)
RθJA
Thermal resistance junction to ambient[1]
-
28.6
°C/W
RθJCBOTTOM
Thermal resistance junction to case bottom [2][3]
-
3.1
°C/W
ΨJT
Thermal characterization parameter junction to top [4]
-
0.3
°C/W
Table 9. Thermal ratings
[1]
Determined in accordance to JEDEC JESD51-2A natural convection environment. Thermal resistance data in this report is solely for a thermal
performance comparison of one package to another in a standardized specified environment. It is not meant to predict the performance of a package in an
application-specific environment.
[2]
Thermal resistance between the die and the printed-circuit board. Board temperature is measured on the top surface of the board near the package.
[3]
For exposed pad packages where the pad would be expected to be soldered, junction to case thermal resistance is a simulated value from the junction to
the exposed pad without contact resistance.
[4]
Thermal test board meets JEDEC specification for this package (JESD51-7).
FS2400
All information provided in this document is subject to legal disclaimers.
© 2024 NXP B.V. All rights reserved.
Product data sheet
Rev. 4 — 23 October 2024
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