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AS4C64M32MD2-25BCN Datasheet(PDF) 12 Page - Alliance Semiconductor Corporation |
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AS4C64M32MD2-25BCN Datasheet(HTML) 12 Page - Alliance Semiconductor Corporation |
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12 / 129 page ![]() devices which do not support the ZQ Calibration command, this command shall be ignored. This command is used to calibrate the LPDDR2 output drivers (RON) over process, voltage, and temperature. Optionally, the MRW ZQ Initialization Calibration command will update MR0 to indicate RZQ pin connection. In systems in which more than one LPDDR2 device exists on the same bus, the controller must not overlap ZQ Calibration commands. The device is ready for normal operation after tZQINIT. 6. Normal Operation: After tZQINIT (Tg), MRW commands shall be used to properly configure the memory, for example the output buffer driver strength, latencies etc. Specifically, MR1, MR2, and MR3 shall be set to configure the memory for the target frequency and memory configuration. The LPDDR2 device will now be in IDLE state and ready for any valid command. After Tg, the clock frequency may be changed according to the clock frequency change procedure described in section “Input clock stop and frequency change” of this specification. Table 1 – Timing Parameters for initialization Symbol Value Unit Comment min max tINIT0 20 ms Maximum Power Ramp Time tINIT1 100 ns Minimum CKE low time after completion of power ramp tINIT2 5 tCK Minimum stable clock before first CKE high tINIT3 200 us Minimum Idle time after first CKE assertion tINIT4 1 us Minimum Idle time after Reset command tINIT5 10 us Maximum duration of Device Auto-Initialization tZQINIT 1 us ZQ Initial Calibration for LPDDR2-S4 devices tCKb 18 100 ns Clock cycle time during boot CK/CK# CKE Tb Tc Td Te Tf Tg Ta CA RTT DQ Supplies RESET MRR tINIT2 tINIT0 tINIT1 tINIT3 tISCKE tINIT5 tINIT4 tZQINIT Figure 3.2 Power Ramp and Initialization Sequence 3.2.2 Initialization after Reset (without Power ramp): If the RESET command is issued outside the power up initialization sequence, the reinitialization procedure shall begin with step 3 (Td). 3.2.3 Power-off Sequence The following sequence shall be used to power off the LPDDR2 device. Unless specified otherwise, these steps are mandatory and apply to S4 devices. While removing power, CKE shall be held at a logic low level (=< 0.2 x VDD2), all other inputs shall be between VILmin and VIHmax. The LPDDR2 device will only guarantee that outputs are in a high impedance state while CKE is held low. DQ, DM, DQS, and DQS# voltage levels must be between VSSQ and VDDQ during power off sequence to avoid latch-up. CK, CK#, CS#, and CA input levels must be between VSSCA and VDD2 during power off sequence to avoid latch-up. AS4C64M32MD2-25BCN AS4C128M16MD2-25BCN Confidential - 12/129 - Rev.1.0 July 2016 |
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