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AS4C64M32MD2-25BCN Datasheet(PDF) 12 Page - Alliance Semiconductor Corporation

Part # AS4C64M32MD2-25BCN
Description  Deep Power Down Mode
PDF  129 Pages
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Manufacturer  ALSC [Alliance Semiconductor Corporation]
Direct Link  https://www.alliancememory.com
Logo ALSC - Alliance Semiconductor Corporation

AS4C64M32MD2-25BCN Datasheet(HTML) 12 Page - Alliance Semiconductor Corporation

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devices which do not support the ZQ Calibration command, this command shall be ignored. This command is used to
calibrate the LPDDR2 output drivers (RON) over process, voltage, and temperature. Optionally, the MRW ZQ
Initialization Calibration command will update MR0 to indicate RZQ pin connection. In systems in which more than one
LPDDR2 device exists on the same bus, the controller must not overlap ZQ Calibration commands. The device is
ready for normal operation after tZQINIT.
6. Normal Operation:
After tZQINIT (Tg), MRW commands shall be used to properly configure the memory, for example the output buffer
driver strength, latencies etc. Specifically, MR1, MR2, and MR3 shall be set to configure the memory for the target
frequency and memory configuration.
The LPDDR2 device will now be in IDLE state and ready for any valid command.
After Tg, the clock frequency may be changed according to the clock frequency change procedure described in
section “Input clock stop and frequency change” of this specification.
Table 1 – Timing Parameters for initialization
Symbol
Value
Unit
Comment
min
max
tINIT0
20
ms
Maximum Power Ramp Time
tINIT1
100
ns
Minimum CKE low time after completion of power ramp
tINIT2
5
tCK
Minimum stable clock before first CKE high
tINIT3
200
us
Minimum Idle time after first CKE assertion
tINIT4
1
us
Minimum Idle time after Reset command
tINIT5
10
us
Maximum duration of Device Auto-Initialization
tZQINIT
1
us
ZQ Initial Calibration for LPDDR2-S4 devices
tCKb
18
100
ns
Clock cycle time during boot
CK/CK#
CKE
Tb
Tc
Td
Te
Tf
Tg
Ta
CA
RTT
DQ
Supplies
RESET
MRR
tINIT2
tINIT0
tINIT1
tINIT3
tISCKE
tINIT5
tINIT4
tZQINIT
Figure 3.2 Power Ramp and Initialization Sequence
3.2.2 Initialization after Reset (without Power ramp):
If the RESET command is issued outside the power up initialization sequence, the reinitialization procedure shall begin
with step 3 (Td).
3.2.3 Power-off Sequence
The following sequence shall be used to power off the LPDDR2 device. Unless specified otherwise, these steps are
mandatory and apply to S4 devices.
While removing power, CKE shall be held at a logic low level (=< 0.2 x VDD2), all other inputs shall be between
VILmin and VIHmax. The LPDDR2 device will only guarantee that outputs are in a high impedance state while CKE is
held low. DQ, DM, DQS, and DQS# voltage levels must be between VSSQ and VDDQ during power off sequence to
avoid latch-up. CK, CK#, CS#, and CA input levels must be between VSSCA and VDD2 during power off sequence to
avoid latch-up.
AS4C64M32MD2-25BCN
AS4C128M16MD2-25BCN
Confidential
- 12/129 -
Rev.1.0 July 2016



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