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AS4C64M32MD2-25BCN Datasheet(PDF) 33 Page - Alliance Semiconductor Corporation |
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AS4C64M32MD2-25BCN Datasheet(HTML) 33 Page - Alliance Semiconductor Corporation |
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33 / 129 page ![]() 4.5 Burst Write Operation The Burst Write command is initiated by having CS# LOW, CA0 HIGH, CA1 LOW and CA2 LOW at the rising edge of the clock. The command address bus inputs, CA5r-CA6r and CA1f-CA9f, determine the starting column address for the burst. The Write Latency (WL) is defined from the rising edge of the clock on which the Write Command is issued to the rising edge of the clock from which the tDQSS delay is measured. The first valid datum shall be driven WL * tCK + tDQSS from the rising edge of the clock from which the Write command is issued. The data strobe signal (DQS) should be driven LOW tWPRE prior to the data input. The data bits of the burst cycle must be applied to the DQ pins tDS prior to the respective edge of the DQS, DQS# and held valid until tDH after that edge. The burst data are sampled on successive edges of the DQS, DQS# until the burst length is completed, which is 4, 8, or 16 bit burst. For LPDDR2-SDRAM devices, tWR must be satisfied before a precharge command to the same bank may be issued after a burst write operation. Input timings are measured relative to the crosspoint of DQS and its complement, DQS#. Figure 4.14: Data Input (WRITE) Timing Transitioning data CK# CK CA[9:0] CMD DQS# DQS T0 T1 T2 T3 T4 Tx Tx+1 Ty Ty+1 WL = 1 DQS# DQS DQ DIN A1 DIN A2 DIN A3 DIN A0 DIN A1 DIN A2 DIN A3 DIN A0 Case 1: tDQSSmax Case 2: tDQSSmin tDQSSmax tDSS tDSS Completion of burst WRITE tWR tWR tRP tDQSSmin tDSH tDSH Figure 4.15 — LPDDR2-SX: Burst write : WL = 1, BL = 4 AS4C64M32MD2-25BCN AS4C128M16MD2-25BCN Confidential - 33/129 - Rev.1.0 July 2016 |
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