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AS4C64M32MD2-25BCN Datasheet(PDF) 33 Page - Alliance Semiconductor Corporation

Part # AS4C64M32MD2-25BCN
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Manufacturer  ALSC [Alliance Semiconductor Corporation]
Direct Link  https://www.alliancememory.com
Logo ALSC - Alliance Semiconductor Corporation

AS4C64M32MD2-25BCN Datasheet(HTML) 33 Page - Alliance Semiconductor Corporation

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4.5 Burst Write Operation
The Burst Write command is initiated by having CS# LOW, CA0 HIGH, CA1 LOW and CA2 LOW at the rising edge of
the clock. The command address bus inputs, CA5r-CA6r and CA1f-CA9f, determine the starting column address for
the burst. The Write Latency (WL) is defined from the rising edge of the clock on which the Write Command is issued
to the rising edge of the clock from which the tDQSS delay is measured. The first valid datum shall be driven WL * tCK
+ tDQSS from the rising edge of the clock from which the Write command is issued. The data strobe signal (DQS)
should be driven LOW tWPRE prior to the data input. The data bits of the burst cycle must be applied to the DQ pins
tDS prior to the respective edge of the DQS, DQS# and held valid until tDH after that edge. The burst data are
sampled on successive edges of the DQS, DQS# until the burst length is completed, which is 4, 8, or 16 bit burst.
For LPDDR2-SDRAM devices, tWR must be satisfied before a precharge command to the same bank may be issued
after a burst write operation.
Input timings are measured relative to the crosspoint of DQS and its complement, DQS#.
Figure 4.14: Data Input (WRITE) Timing
Transitioning data
CK#
CK
CA[9:0]
CMD
DQS#
DQS
T0
T1
T2
T3
T4
Tx
Tx+1
Ty
Ty+1
WL = 1
DQS#
DQS
DQ
DIN
A1
DIN
A2
DIN
A3
DIN
A0
DIN
A1
DIN
A2
DIN
A3
DIN
A0
Case 1: tDQSSmax
Case 2: tDQSSmin
tDQSSmax
tDSS
tDSS
Completion of burst WRITE
tWR
tWR
tRP
tDQSSmin
tDSH
tDSH
Figure 4.15 — LPDDR2-SX: Burst write : WL = 1, BL = 4
AS4C64M32MD2-25BCN
AS4C128M16MD2-25BCN
Confidential
- 33/129 -
Rev.1.0 July 2016



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