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MPF5024AMBA0ES Datasheet(PDF) 62 Page - NXP Semiconductors

Part # MPF5024AMBA0ES
Description  Power management integrated circuit (PMIC) for high performance applications
PDF  93 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

MPF5024AMBA0ES Datasheet(HTML) 62 Page - NXP Semiconductors

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NXP Semiconductors
PF5024
Power management integrated circuit (PMIC) for high performance applications
PF5024
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2020. All rights reserved.
Product data sheet
Rev. 1 — 15 April 2020
62 / 93
Symbol
Parameter
Min
Typ
Max
Unit
FSSRANGE
Spread-spectrum range
FSS_RANGE= 1
via CLK_FREQ[3:0]
Spread-spectrum is done around center frequency of
20 MHz
—
±10
—
%
FSSmod
Spread spectrum frequency modulation
—
24
—
kHz
Clock synchronization
fSYNCIN
SYNC input frequency range
FSYNC_RANGE = 0
2000
—
3000
kHz
fSYNCIN
SYNC input frequency range
FSYNC_RANGE = 1
333
—
500
kHz
fSYNCOUT
SYNC output frequency range
via CLK_FREQ[3:0]
2000
—
3000
kHz
VSYNCINLO
Input frequency low voltage threshold
—
—
0.3*VDDIO
V
VSYNCINHI
Input frequency high voltage threshold
0.7*VDDIO
—
—
V
RPD_SYNCIN
SYNC internal pull down resistance
0.475
1.0
__
MΩ
VSYNCOUTLO
Output frequency low voltage threshold
0
—
0.4
V
VSYNCOUTHI
Output frequency high voltage threshold
VDDIO − 0.5
—
—
V
15.5 Thermal monitoring
The PF5024 features a temperature sensor at the center of the die which is used to
generate the thermal interrupts and thermal shutdown.
Figure 27 shows a high level block diagram of the thermal monitoring architecture in
PF5024.
aaa-029998
COMP
Tsense
TEMP_IC
BG
VTemp
V155C
V165C
(TSD)
V140C
V125C
V110C
V95C
V80C
DIGITAL LOGIC
STATE MACHINE
(THERMAL INTERRUPT
DECODING)
AMUX
Figure 27. Thermal monitoring architecture



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