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MPF5024AMBA0ES Datasheet(PDF) 91 Page - NXP Semiconductors

Part # MPF5024AMBA0ES
Description  Power management integrated circuit (PMIC) for high performance applications
PDF  93 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

MPF5024AMBA0ES Datasheet(HTML) 91 Page - NXP Semiconductors

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NXP Semiconductors
PF5024
Power management integrated circuit (PMIC) for high performance applications
PF5024
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2020. All rights reserved.
Product data sheet
Rev. 1 — 15 April 2020
91 / 93
Tables
Tab. 1.
Ordering information ..........................................2
Tab. 2.
Pin description ...................................................4
Tab. 3.
Absolute maximum ratings ................................5
Tab. 4.
ESD ratings .......................................................5
Tab. 5.
Thermal characteristics ..................................... 6
Tab. 6.
QFN40 thermal resistance and package
dissipation ratings ............................................. 6
Tab. 7.
Operating conditions ......................................... 6
Tab. 8.
Voltage supply summary ...................................8
Tab. 9.
Device differences .............................................8
Tab. 10. State machine transition definition .................. 10
Tab. 11. Fail-safe OK timer configuration ......................17
Tab. 12. UVDET threshold ............................................ 17
Tab. 13. VIN_OVLO debounce configuration ................ 18
Tab. 14. VIN_OVLO specifications ................................18
Tab. 15. Startup timing requirements (PWRON pulled
up) ................................................................... 19
Tab. 16. Startup with PWRON driven high externally
and LPM_OFF = 0 .......................................... 20
Tab. 17. Power up time base register ........................... 21
Tab. 18. Power up sequence registers ..........................21
Tab. 19. Power down regulator group bits .................... 25
Tab. 20. Power down counter delay ..............................25
Tab. 21. Programmable delay after RESETBMCU is
asserted ...........................................................25
Tab. 22. Power down delay selection ............................26
Tab. 23. Regulator control during fault event bits ..........27
Tab. 24. Fault timer register configuration .....................30
Tab. 25. Fault bypass bits .............................................30
Tab. 26. Interrupt registers ............................................ 35
Tab. 27. I/O electrical specifications ..............................36
Tab. 28. PWRON debounce configuration in edge
detection mode ................................................38
Tab. 29. TRESET configuration .....................................38
Tab. 30. Standby pin polarity control .............................38
Tab. 31. PGOODx assignment ......................................41
Tab. 32. ENx assignment .............................................. 41
Tab. 33. I2C address configuration ............................... 45
Tab. 34. Secure bits ...................................................... 46
Tab. 35. Internal supplies electrical characteristics ....... 47
Tab. 36. SWx ramp rates .............................................. 48
Tab. 37. SWx output voltage configuration ....................49
Tab. 38. SWx regulator mode configuration .................. 49
Tab. 39. SWx current limit selection ..............................50
Tab. 40. SWx phase configuration ................................ 50
Tab. 41. SWx inductor selection bits .............................50
Tab. 42. OTP_SW1CONFIG register description .......... 51
Tab. 43. OTP_SW4CONFIG register description .......... 51
Tab. 44. Type
1
buck
regulator
electrical
characteristics ..................................................52
Tab. 45. Recommended external components ..............54
Tab. 46. UV threshold configuration register ................. 54
Tab. 47. OV threshold configuration register .................55
Tab. 48. UV debounce timer configuration ....................55
Tab. 49. OV debounce timer configuration ....................55
Tab. 50. VMON electrical characteristics ...................... 57
Tab. 51. Manual frequency tuning configuration ............59
Tab. 52. Clock management specifications ...................61
Tab. 53. Thermal monitor specifications ........................63
Tab. 54. Thermal monitor bit description .......................63
Tab. 55. AMUX channel selection ................................. 64
Tab. 56. Watchdog duration register ............................. 65
Tab. 57. Soft WD register reset .....................................67
Tab. 58. Default hardwire configuration .........................79
Tab. 59. Quiescent current requirements ...................... 82
Tab. 60. Revision history ...............................................88
Figures
Fig. 1.
Simplified application diagram ...........................2
Fig. 2.
Internal block diagram .......................................3
Fig. 3.
Pin configuration for 40-pin QFN .......................4
Fig. 4.
Functional block diagram .................................. 7
Fig. 5.
State diagram ....................................................9
Fig. 6.
Startup with PWRON pulled up .......................19
Fig. 7.
Startup with PWRON driven high externally
and bit LPM_OFF = 0 ..................................... 20
Fig. 8.
Power up/down sequence between Off and
system On state ..............................................22
Fig. 9.
Power up/down sequence between run and
standby ............................................................23
Fig. 10.
Group power down sequence example ...........26
Fig. 11.
Power down delay ...........................................27
Fig. 12.
Regulator turned off upon with RegX_
STATE = 0 and FLT_REN = 0 ........................ 28
Fig. 13.
Regulator turned off upon with RegX_
STATE = 0 and FLT_REN = 1 ........................ 29
Fig. 14.
Correct power up (no fault during power up) ....32
Fig. 15.
Power up sequencer with a temporary failure .. 33
Fig. 16.
Power up sequencer aborted as fault
persists for longer than 2.0 ms ........................34
Fig. 17.
I/O interface diagram .......................................36
Fig. 18.
XFAILB behavior during a power up
sequence .........................................................43
Fig. 19.
XFAILB behavior during a power down
sequence .........................................................43
Fig. 20.
Behavior during an external XFAILB event ......44
Fig. 21.
External XFAILB event during a power up
sequence .........................................................44
Fig. 22.
8 bit SAE J1850 CRC polynomial ................... 46
Fig. 23.
Buck regulator block diagram ..........................48
Fig. 24.
Voltage monitoring architecture .......................56
Fig. 25.
Clock management architecture ......................58
Fig. 26.
Spread-spectrum waveforms ...........................60
Fig. 27.
Thermal monitoring architecture ......................62
Fig. 28.
Watchdog timer operation ............................... 66
Fig. 29.
Soft WD reset behavior ...................................68



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