MM912F634CV2AP datasheet(12/335 Pages) FREESCALE

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Electrical Characteristics

Operating Conditions

MM912F634

Freescale Semiconductor

3.3

Operating Conditions

This section describes the operating conditions of the device. Unless otherwise noted those conditions apply to all the following

data.

Table 6. Maximum Electrical Ratings - MCU Die

Ratings

Symbol

Value

Unit

5.0 V Supply Voltage

VEDDX

-0.3 to 6.0

2.5 V Supply Voltage

VEDD

-0.3 to 2.75

Digital I/O input voltage (PA0...PA7, PE0, PE1)

VIN

-0.3 to 6.0

EXTAL, XTAL

VILV

-0.3 to 2.16

TEST input

VTEST

-0.3 to 10.0

Instantaneous maximum current

Single pin limit for all digital I/O pins

-25 to 25

Instantaneous maximum current

Single pin limit for EXTAL, XTAL

-25 to 25

Table 7. Maximum Thermal Ratings

Ratings

Symbol

Value

Unit

Storage Temperature

TSTG

-55 to 150

°C

Package (98ASA00173D), Thermal Resistance

RθJA

max. 48

k/W

Peak Package Reflow Temperature During Reflow(5),(6)

TPPRT

300

°C

Notes

5. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

6. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes

and enter the core ID to view all orderable parts. (i.e. MC34xxxD enter 34xxx), and review parametrics.

Table 8. Operating Conditions

Ratings

Symbol

Value

Unit

Analog Die Nominal Operating Voltage

VSUP

5.5 to 18

Analog Die Functional Operating Voltage - Device is fully functional. All

features are operating.

VSUPOP

5.5 to 27

MCU I/O and supply voltage(7)

VEDDX

4.5 to 5.5

MCU Digital logic supply voltage(7)

VEDD

2.25 to 2.75

MCU External Oscillator

fOSC

4.0 to 16

MHz

MCU Bus frequency

fBUS

fBUSMAX(8)

MHz

Operating Ambient Temperature

MM912x634xVxxx

-40 to 105

°C

Operating Junction Temperature - Analog Die

TJ_A

-40 to 150

°C

Operating Junction Temperature - MCU Die

TJ_M

-40 to 140

°C

Note:

7. During power up and power down sequence always VDD < VDDX

8. fBUSMAX frequency ratings differ by device and is specified in Table 1

MM912F634CV2AP Datasheet(PDF) 12 Page - Freescale Semiconductor, Inc

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