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BQ76PL455APFCT Datasheet(PDF) 116 Page - Texas Instruments |
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BQ76PL455APFCT Datasheet(HTML) 116 Page - Texas Instruments |
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116 / 125 page ![]() BAT0 COMMH COMML GND CGND Keep all signal Traces on Top and Bottom Layers COMMH COMML GND BAT0 CGND Middle Layers Isolation Keepout COMMH COMML 116 bq76PL455A SLUSCL0A – SEPTEMBER 2016 – REVISED OCTOBER 2016 www.ti.com Product Folder Links: bq76PL455A Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Layout Example (continued) An unbroken ground plane layer as part of a four or more layer board is recommended, with all AGND, DGND, and CGND connections made directly to the plane. The common GND planes are star connected directly to BAT0. There should also be a keep-out area on plane area adjacent to the isolation capacitors if daisy-chain communication is implemented. The following is a list of grounds. • AGND1 – Power section (noisy GND) • AGND2 – GND for Front end output • AGND3 – GND for ADC input • DGND1, DGND2, DGND3 – Digital GND • CGND – Communications digital GND Figure 40. Simplified Layout Guideline 10.3 Board Construction and Accuracy The accuracy numbers provided in are based on the following board stack. Results may vary with board thickness, layout, solder profile, and so forth. |
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